SourcingAI

Dram

I have found results from10000+products and2000+suppliers aboutDram

Commonly Used:
US$
Customization Available
Sample Available
Manufacturer First
Product Attributes:
Type: IPC
Application: Laptop
Memory Capacity: 4G
Operate Mode: DRAM
Performance: Normal
Interface Form: DIMM
Color: Black
Memory Type: DDR3
Frequency: 1600MHz
Pin: 184
Max. CPUs: 1
Number of CPu Threads: 8
Processor Type: Intel Xeon
With Cooling Fin
Integration: MSI
Technics: Semiconductor IC
Bipolar Integrated Circuit
-55℃ - 125℃
Shape: Flat
Application: Desktop
Application: Medical
Application: Industrial
Application: Server
Memory Capacity: 8G
Operate Mode: SDRAM
Performance: Automatic Check
Automatic Error Correction
Color: Green
Memory Type: DDR
Pin: 204
Within Cooling Fin
Integration: GSI
Thin Film IC
Unipolar Integrated Circuit

Sourcing guidance for DRAM

What technical specifications are critical when sourcing DRAM for industrial or commercial applications?

Buyers must prioritize Generation (DDR4 vs. DDR5), Clock Speed (MHz), and Latency (CL). For industrial use, ensure the modules support ECC (Error Correction Code) to prevent data corruption. Additionally, verify the operating temperature range, especially for embedded systems, where Industrial Grade (-40°C to 85°C) is often required over standard commercial grades.

How can I ensure the compatibility and stability of DRAM modules with existing hardware?

Always request the SPD (Serial Presence Detect) data sheet to confirm timing parameters. It is essential to verify Voltage requirements (e.g., 1.1V for DDR5 vs 1.2V for DDR4) to ensure power management IC (PMIC) compatibility. For large-scale deployments, sourcing Original Brand Chips (Samsung, SK Hynix, Micron) ensures higher stability and lower RMA rates compared to 'white-label' or re-marked chips.

What compliance standards and certifications should be verified for international DRAM trade?

DRAM modules must comply with RoHS (Restriction of Hazardous Substances) and REACH for environmental safety. For electronics entering the US, FCC certification is necessary, while the CE mark is mandatory for the EU. Furthermore, ensure the supplier adheres to JEDEC (Joint Electron Device Engineering Council) standards to guarantee universal physical and electrical interchangeability.

How does the 'Die Revision' affect long-term procurement projects?

In long-term B2B projects, Die Revision (e.g., Samsung B-Die vs. E-Die) is crucial because manufacturers periodically update their silicon. A change in die can lead to stability issues in sensitive systems. Buyers should negotiate a Fixed BOM (Bill of Materials) agreement with suppliers to ensure that the internal components do not change without prior notification.

Cross-Border DRAM Procurement Risks and Strategies

How can I mitigate the risk of receiving counterfeit or 're-marked' DRAM chips?

Counterfeiting is a high risk in the semiconductor industry. Request high-resolution photos of the chip markings and use third-party inspection services to perform X-ray testing or decapsulation if necessary. Only deal with Audited Suppliers on Made-in-China.com who can provide traceability back to the original wafer fabrication plant.

What is the best strategy for negotiating prices in the highly volatile DRAM market?

DRAM prices fluctuate daily based on global spot market trends. Instead of a fixed annual price, negotiate a formula-based pricing model linked to market indices (like DRAMeXchange). For bulk orders, aim for Price Protection clauses where the supplier compensates for price drops occurring shortly after the purchase order is signed.

What are the specific logistics and packaging requirements for shipping DRAM internationally?

DRAM is highly sensitive to ESD (Electrostatic Discharge). Ensure the supplier uses Anti-static trays or bags and vacuum-sealed moisture barrier bags (MBB) with humidity indicator cards. For shipping to countries with strict customs, ensure the HS Code (typically 8473.30) is correctly declared to avoid delays or incorrect tariff applications.

How can I ensure transaction security when dealing with high-value semiconductor orders?

Given the high unit value of DRAM, use Secured Payment services provided by platforms like Made-in-China.com to ensure funds are only released upon proof of shipment. For first-time large orders, consider using a Letter of Credit (L/C) and mandate a pre-shipment inspection (PSI) to verify quantity and specifications before the balance is paid.

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