Metal copper sputtering target
I have found results from2000+products and900+suppliers aboutMetal copper sputtering target
High-Quality Gr2 Pure Titanium Sputtering Target for Coating
Cu Sputtering Target/Copper Rotary Target for Metal-Coated Conductor/ Semiconductor
High Purity Metal Cu Copper Plate Sputtering Target
Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
99.95% Fe Iron Sputtering Target Bonding with Copper Plate
99.95%Nicu Sputtering Target Nickel Copper Alloy Plate Custom Size Packaging
Xinkang 99.9%-99.9999% Metal Cu Copper Sputtering Targets for Optical Thin Film Coating
Xinkang 4n-6n Metal Material Copper Target PVD Vacuum Cu Copper Sputtering Target
Metal Copper Ofhc T2 Red Cu Sputtering Target Copper Planar Round Target
99.999% Purity Customized Size Copper Metal Target Cu Magnetron Sputtering Target
High Purity 4n 99.99% Metal Cu Copper Rectangle Targets Magnetron Sputtering Target
Copper Nickel Magnanese Cunimn55/44/1wt% Sputtering Target for PVD Coating
High Purity Copper Aluminum Target Cual50at% 99.99% Copper Aluminum Sputtering Target
Xk Metal Tin Targets Sn Sputtering Targets with Copper Backing Plate
High Purity 99.99% 4n Metal Tin Sn Sputtering Target with Copper Bonding
PVD Target 4n 4n5 5n Nickel Sputtering Target with Copper Backing Plate
Copper Sputtering Target Metal Copper Disc 99.9% Copper Magnetron Target
Rectangle Nickel Vanadium Material Niv Sputtering Target Bonded with Copper Backing Plate
Customize Metal Tin Target 99.99% Pure Sn Tin Sputtering Targets with Copper Plate Bonding
Cu Sputtering Target/Copper Rotary Target for Metal-Coated Conductor/ Semiconductor
OEM Supported Copper Metal Target 99.999% Purity for Magnetron Sputtering
99.999% Pure Copper Metal Target for Magnetron Sputtering Applications
99.99% Copper Nickel Titanium Sputtering Targets Cuniti Disc with High Purity Level
Pure Ruthenium Sputtering Target for Semiconductor Copper Interconnect, Nano-Coating Research & Energy Storage Devices
Sourcing guidance for Metal Copper Sputtering Target
What are the critical purity levels required for Copper Sputtering Targets in semiconductor and PVD applications?
For high-performance thin-film deposition, purity is the most vital factor. You should prioritize targets with a purity of 4N (99.99%), 5N (99.999%), or even 6N (99.9999%) depending on the sensitivity of your application. High purity ensures low electrical resistivity and minimizes the presence of alkali metals and radioactive elements that can cause device failure in integrated circuits.
How does grain size and orientation affect the sputtering process?
A fine and uniform grain size (typically <100μm) is essential for achieving a consistent sputtering rate and uniform film thickness. Furthermore, controlled crystallographic orientation (texture) ensures that the atoms are ejected predictably, which directly impacts the step coverage and quality of the deposited copper layer.
What technical specifications should be confirmed regarding the target's density and gas content?
To prevent micro-arcing and particle generation during the PVD process, the target must have a relative density of >99%. Additionally, verify the oxygen (O), nitrogen (N), and hydrogen (H) content; for high-end electronics, oxygen content should ideally be below 10ppm to ensure maximum conductivity and film adhesion.
What are the common shapes and bonding requirements for industrial copper targets?
Targets are generally supplied as planar (circular or rectangular) or rotary (cylindrical). Because copper is prone to thermal expansion, large targets often require bonding to a copper or molybdenum backplate using Indium (In) solder. Ensure the supplier provides a ultrasonic bonding inspection report to guarantee a void-free interface for efficient cooling.
Cross-Border Procurement Strategy for High-Purity Materials
How can I mitigate the risk of receiving sub-standard purity levels in a cross-border transaction?
Always request a Certificate of Analysis (COA) and a Glow Discharge Mass Spectrometry (GDMS) test report for the specific batch. For high-value orders, it is highly recommended to use Made-in-China.com's inspection services or a third-party auditor like SGS to verify the material grade before the final balance payment is made.
What are the key considerations for international shipping and packaging of copper targets?
Copper is highly susceptible to oxidation and surface contamination. Ensure the supplier uses vacuum-sealed double-layer plastic bags with desiccant, placed inside shock-proof wooden crates. For logistics, specify air freight for high-purity targets to minimize the time exposed to humid maritime environments, which can degrade surface quality.
How should I negotiate pricing given the volatility of raw copper markets?
Sputtering target prices are usually composed of the raw material market price (LME/SHFE Copper) plus a fabrication/processing fee. When negotiating, suggest a formula-based pricing model that adjusts with the market index to ensure fairness. For long-term stability, look for suppliers on Made-in-China.com who have integrated smelting capabilities, as they offer better price protection than pure processors.
What transaction security measures should be taken for high-value metal orders?
Utilize Secured Trading services provided by Made-in-China.com to ensure that funds are only released upon confirmation of receipt and quality validation. Given the high scrap value of copper, ensure the Incoterms (e.g., CIF or DAP) are clearly defined in the contract to establish exactly when the risk of loss transfers from the seller to the buyer.


























