Multi-layer Capability: Supports 1 to 20 layers with blind, buried, and via-in-pad technologies.
High Precision Manufacturing: Min line width/space 3mil (0.075mm) and min hole size 0.1mm.
Diverse Surface Finishes: Offers ENIG, OSP, HASL, Immersion Tin, and Flash Gold options.
Comprehensive Certifications: Certified with UL, ISO 9001, ISO 14001, and IATF 16949.
Fast Turnaround: Average lead time within 15 working days for both peak and off-peak seasons.
Advanced PCBA Capacity: Handles BGA, 0201 chips, and odd-form parts with full reflow and IR rework.
Customizable Packaging: Cartons can be printed with customer address and specific destination details.
Rigorous Quality Control: 100% E-Test, X-ray analysis, and microscope inspection up to 20X.