High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB Rigid Flex PCB Rigid-Flexible PCB FPC PCB Manufacturing

Name: High Precision Multilayer PCB Printed Circuit Boards Blind and Buried Via Rigid Flexible HDI PCB Rigid Flex PCB Rigid-Flexible PCB FPC PCB Manufacturing
Brand: Abis Circuits Co., Ltd.
SKU: 1962064415

Guangdong, ChinaAbis Circuits Co., Ltd.

US$0.10-50.00

1 piece

Sample price:US$0.10/piece.Request sample

Product profile

Customization

Available

Structure

Multilayer Rigid PCB

Dielectric

FR-4

Model NO.

pcb

Material

Polyester Glass Fiber Mat Laminate

Application

Communication

Flame Retardant Properties

Processing Technology

Electrolytic Foil

Production Process

Additive Process

Base Material

Copper

Insulation Materials

Metal Composite Materials

Brand

Abis

Combination Mode

Adhesive Flexible Plate

Conductive Adhesive

Conductive Silver Paste

Transport Package

Vacuum Packing

Specification

240*200

Trademark

ABIS CIRCUITS CO., LTD

Origin

Shenzhen, China

HS Code

85340090

Production Capacity

720000m2/Year

Company profile

Abis Circuits Co., Ltd.

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2006-10-04Nearest Port: Shenzhen, HongKongAverage Response Time: ≤15hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAP, FCA

AI-Powered supplier vetting

SummaryABIS Circuits Co., Ltd. is identified as a China-based manufacturer/factory specializing in PCB, PCBA, EMS, OEM, and circuit-board production. The supplier reports over 10 years of international-business experience, export sales of 71%–90%, more than 500 global customers, approximately 1,100 employees, two PCB workshops, 31–40 years of combined R&D-engineer experience, 50 quality-control staff, two production lines, and annual PCB capacity of 60,000 square meters. Reported certifications include ISO 9001, ISO 14001, IATF/TS 16949, SGS, and UL, although the certification details and validity are not independently verified in the provided information. The supplier states capabilities for boards up to 20 layers, blind and buried boards, Rogers, high-TG, aluminum-base, and flexible boards. Specific after-sales processes, financial health, innovation outputs, and named customer case details remain insufficiently documented.

Supplier typeABIS Circuits Co., Ltd. is explicitly described as a Manufacturer/Factory and PCB manufacturer based in Shenzhen, Guangdong, China. Its stated operations include two PCB workshops and specialization across industrial, telecommunications, automotive, medical, consumer, and security applications.

CertificationsThe supplier reports TS 16949/IATF 16949, ISO 9001, ISO 14001, SGS, and UL certifications. These statements indicate broad quality, environmental, automotive, and product-compliance coverage, but the provided slices do not include certificate numbers, issuing dates, scopes, or validity verification.

R&D capabilityThe supplier reports 31–40 years of total R&D-engineer experience and claims production of advanced PCB types, including up to 20-layer, blind and buried, Rogers, high-TG, aluminum-base, and flexible boards. These support technical development capability, but no patents, proprietary technologies, new-product records, or R&D investment evidence is supplied.

Production capacityThe supplier reports approximately 1,100 employees, two PCB workshops, two production lines, 50 quality-control staff, and PCB manufacturing capacity of 60,000 square meters. These explicit capacity and staffing data support established production capability, although the slices do not provide utilization, equipment details, lead times, or verified output records.

Customization capabilityThe supplier explicitly offers PCB, PCBA, EMS, OEM, and circuit-board services and states that it can provide multiple specialized board formats and materials, including up to 20 layers, blind and buried boards, Rogers, high-TG, aluminum-base, and flexible boards. This directly supports a broad degree of product customization.