High Quality Multilayer PCB Printed Circuit Board with Immersion Gold Cem1 Fr4 PCB Board

Name: High Quality Multilayer PCB Printed Circuit Board with Immersion Gold Cem1 Fr4 PCB Board
Brand: Abis Circuits Co., Ltd.
SKU: 852532305

Guangdong, ChinaAbis Circuits Co., Ltd.

US$0.01-100.00

1 piece

Sample price:US$0.01/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

FR-4

Model NO.

PCB-A39

Material

Fiberglass Epoxy

Application

Consumer Electronics

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Epoxy Resin

Brand

Abis

Layer

1-40 Layers

Raw Material

Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.

Board Thickness

0.20mm-8.00mm

Board Outline Tolerance

+0.10mm

Minimum Line/Space

0.075mm

Surface Finish/Treatment

HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

Transport Package

Vacuum Packing

Specification

240*200

Trademark

ABIS CIRCUITS CO., LTD

Origin

Shenzhen, China

HS Code

85340090

Production Capacity

720000m2/Year

Company profile

Abis Circuits Co., Ltd.

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2006-10-04Nearest Port: Shenzhen, HongKongAverage Response Time: ≤9.10hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAP, FCA

AI-Powered supplier vetting

SummaryABIS Circuits Co., Ltd. is identified as a China-based manufacturer/factory specializing in PCB, PCBA, EMS, OEM, and circuit-board production. The supplier reports over 10 years of international-business experience, export sales of 71%–90%, more than 500 global customers, approximately 1,100 employees, two PCB workshops, 31–40 years of combined R&D-engineer experience, 50 quality-control staff, two production lines, and annual PCB capacity of 60,000 square meters. Reported certifications include ISO 9001, ISO 14001, IATF/TS 16949, SGS, and UL, although the certification details and validity are not independently verified in the provided information. The supplier states capabilities for boards up to 20 layers, blind and buried boards, Rogers, high-TG, aluminum-base, and flexible boards. Specific after-sales processes, financial health, innovation outputs, and named customer case details remain insufficiently documented.

Supplier typeABIS Circuits Co., Ltd. is explicitly described as a Manufacturer/Factory and PCB manufacturer based in Shenzhen, Guangdong, China. Its stated operations include two PCB workshops and specialization across industrial, telecommunications, automotive, medical, consumer, and security applications.

CertificationsThe supplier reports TS 16949/IATF 16949, ISO 9001, ISO 14001, SGS, and UL certifications. These statements indicate broad quality, environmental, automotive, and product-compliance coverage, but the provided slices do not include certificate numbers, issuing dates, scopes, or validity verification.

R&D capabilityThe supplier reports 31–40 years of total R&D-engineer experience and claims production of advanced PCB types, including up to 20-layer, blind and buried, Rogers, high-TG, aluminum-base, and flexible boards. These support technical development capability, but no patents, proprietary technologies, new-product records, or R&D investment evidence is supplied.

Production capacityThe supplier reports approximately 1,100 employees, two PCB workshops, two production lines, 50 quality-control staff, and PCB manufacturing capacity of 60,000 square meters. These explicit capacity and staffing data support established production capability, although the slices do not provide utilization, equipment details, lead times, or verified output records.

Customization capabilityThe supplier explicitly offers PCB, PCBA, EMS, OEM, and circuit-board services and states that it can provide multiple specialized board formats and materials, including up to 20 layers, blind and buried boards, Rogers, high-TG, aluminum-base, and flexible boards. This directly supports a broad degree of product customization.