Full-Process Packaging Inspection: Covers pre-sealing, gold wire bonding, lead frames, and die attach measurement scenarios.
High-Precision Optical Imaging: Features 8X/13X telecentric lenses and 10X objectives for low distortion and superior accuracy.
Multi-Dimensional Measurement: Detects dimensions, height, concentricity, pad size, and angularity for various chip parameters.
High-Speed Motion Stage: AC servo motors with 100 mm/s speed and 0.0001 mm precision linear scales.
HD Imaging & Composite Light: 5MP Gigabit camera with dual-light LED coaxial and parallel transmission illumination.
Expandable Configurations: Optional 5X/20X objectives and vibration isolation air mounts for ultra-high precision.
One Year Warranty: Comprehensive warranty coverage for one year from the date of delivery.
Customization Options: Full customization available from designs with OEM and ODM services.