Reliable Front-End Cleaning Tools for Semiconductor Industry Standards

Dynamic Motion Control: Dynamically controls relative motion between megasonic generator and wafer for uniform energy distribution.

High Throughput Capacity: Configurable up to 8 chambers with a throughput of 225 wafers per hour.

Versatile Chemical Options: Supports double-sided cleaning with up to 5 types of chemicals including DHF, SC1, SC2, and Solvents.

Chemical Recycling System: Integrated module allows recycling of up to 2 types of cleaning chemicals.

Compact Equipment Design: Space-saving dimensions of 2.35m x 5.53m x 2.85m (width x length x height).

Customization Services: Offers full customization and customization from designs via OEM and ODM services.

Broad Application Scope: Suitable for deep trench, post-CMP, post-hard mask, and pre-deposition cleaning processes.

Efficient Cleaning Performance: Enhances cleaning efficiency and reduces material waste and surface damage compared to traditional methods.