Tailored Wafer Optic Solutions for Global Industry Applications

Diverse Glass Compositions: Multiple glass types available with varying Abbe values and refractive indices for specific applications.

High Precision Manufacturing: Low thickness variation and tight tolerances ensure high-precision wafers for optical and semiconductor processes.

Full Customization Options: Supports full customization from designs, including various sizes, shapes, features, and laser processing.

Large Volume Capacity: Capable of supplying up to 60,000 wafers per month to meet high-demand production needs.

Advanced Metrology: World-class metrology minimizes reliability risks and provides high-resolution data across the full wafer.

Expert Technical Support: Fracture mechanics glass strength experts available for training and consultation on diverse applications.

Broad Application Scope: Suitable for micro-optics, 3D sensors, beam shaping, RF components, and nanoimprint lithography substrates.

Flexible Lead Times: Typical lead time ranges from 2 to 12 weeks, with peak and off-peak seasons both requiring one month.