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Fully Automatic Silicon Wafer Cutting Machine
US$6,500.00-7,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Available

Warranty

1 Year

Model NO.

bw

Main Unit Weight

2500

Surface Roughness

Ra0.8(Um)

Electrode Wire Diameter Range

0.7/2.5mm

Machine Tool Guide Rail

Steel Guide Rail, Linear Guide Rail

Z-Axis Travel

500

Maximum Load Capacity

600kg

Maximum Machining Speed

160(mm/Min)

Maximum Power Consumption

2kw

Voltage

380V50Hz

Transport Package

Custom

Specification

700*750*1850

Trademark

N/A

Origin

China

Key features

High Cutting Efficiency: Maximum machining speed reaches 160 mm/min for efficient silicon wafer production.
Low Silicon Loss: Specialized diamond wire cutting technology ensures minimal material waste and high quality.
Wide Compatibility: Processes silicon rods for 8-inch and 12-inch wafers with max length of 450mm.
Stable Performance: Features steel and linear guide rails for good stability during operation.
1-Year Warranty: Comprehensive 1-year warranty coverage with available after-sales service support.

Company profile

Nanjing Bangwin Thermal Equipment Co., Ltd.
Importers and ExportersHigh Repeat Buyers ChoiceExperienced Team
Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤3.46hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA

About Our Factory & Business Background

AddressXinian Center, No. 1, Helu Road, Nanjing, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsPlate Heat Exchanger, Heat Exchanger, Shell and Tube Heat Exchanger, Fin Heat Exchanger, Finned Tube

Our Industry Experience & Global Business Record

Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

Product Q&A

Q:What types of silicon wafers can this machine process?
A:
It processes silicon rods compatible with 8-inch and 12-inch wafers, with a maximum processing length of 450mm.
Q:What is the maximum machining speed?
A:
The maximum machining speed is 160 mm/min, ensuring high cutting efficiency.
Q:Does the machine offer after-sales service?
A:
Yes, after-sales service is available, and the product comes with a 1-year warranty.
Q:What is the power consumption of the machine?
A:
The maximum power consumption is 2kw, operating at 380V 50Hz voltage.
Q:What are the main features of this cutting machine?
A:
It features low silicon loss, high processing quality, high cutting efficiency, and good stability using diamond wire technology.

Send Inquiry

*To:Nanjing Bangwin Thermal Equipment Co., Ltd.Nanjing Bangwin Thermal Equipment Co., Ltd.
*Content:
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