Is after-sales service available?

Yes, after-sales service is available for this product.

What is the maximum grinding size?

The maximum grinding size is 110 mm.

Semiconductor IC Wafer Grinding Equipment for Production Line

Name: Semiconductor IC Wafer Grinding Equipment for Production Line
Brand: Nanjing Bangwin Thermal Equipment Co., Ltd.
SKU: 2291063565

Jiangsu, ChinaNanjing Bangwin Thermal Equipment Co., Ltd.

US$6,500.00

1 Piece

Product profile

Customization

Available

After-sales Service

Available

Warranty

1 Year

Model NO.

Certification

ISO, CE

Condition

New

Voltage

380V

Application

Metal Coil

Power (Kw)

1.5

Weight (Kg)

600

Machining Accuracy

High Precision

Grinding Wheel Speed

60 (Rpm)

Maximum Grinding Size

110 (mm)

Control Method

CNC

Transport Package

Custom

Specification

700*950*1950mm

Trademark

N/A

Origin

China

Key features

AC Variable Frequency Drive: Ensures smooth start and stop for reliable operation.

Four Pressure Levels: Includes light, medium, heavy, and finishing pressure options.

CNC Control Method: Allows direct input of motor speed and running time.

Adjustable Grinding Disc: Freely raises and lowers with manual adjustment for stability.

Slow-Descent Cylinder: Prevents breakage of thin workpieces with independent pressure control.

Electronic Preset Counter: Accurately controls grinding revolutions and desired results.

Diamond Dressing Wheels: Available for disc dressing to maintain precision.

Large-Size Drive Shaft: Enhances rigidity to eliminate vibrations.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceExperienced Team

Nanjing Bangwin Thermal Equipment Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤6.22hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA

AI-Powered supplier vetting

SummaryNanjing Bangwin Thermal Equipment Co., Ltd. is described as a limited-company manufacturer of plate, shell-and-tube, plate-fin, tubular, and finned-tube heat exchangers, with stated R&D, design, production, and sales activities. It offers multiple forms of customization and has technical personnel supporting customer-request confirmation, product design, production, and after-sales service. However, the supplier reports only one R&D engineer, no new products launched in the past year, no ODM or SDK capability, and no OEM service for popular brands. Quality traceability, quality assurance, environmental compliance, and fire-drill status are unknown. It has no overseas warehouse, showroom, agent or branch, and has not participated in offline trade shows. Service procedures exist but have no records, while complaint handling and corrective-action mechanisms are not clearly defined.

Supplier typeThe supplier is identified as Nanjing Bangwin Thermal Equipment Co., Ltd., a professional manufacturer integrating R&D, design, production, and sales. Its stated product scope covers several heat-exchanger types, and it is organized as a limited company with four employees and an affiliated company.

R&D capabilityThe supplier reports one R&D engineer and describes technical responsibilities covering customer-request confirmation, new-product design, and technical support. Nevertheless, it launched no new products in the past year, has no available SDK, does not provide ODM services, and only generally describes a professional technical innovation team.

Production capacityThe company is described as a manufacturer with production activity covering multiple heat-exchanger categories. However, the stated quantity and size of quality-control test equipment is zero, and no production capacity, facility scale, or output data are provided; this creates an explicit quality-control equipment deficiency while leaving overall production scale unverified.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. These stated services directly support a broad customization capability.