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Semiconductor Wafer Edge Rounding Machine for IC Industry
US$7,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
AvailableWarranty
1 YearModel NO.
bwAutomatic
AutomaticStyle
DesktopCertification
GS, CE, ISOPower (Kw)
2Weight (Kg)
350Grinding Disc Size
4 InchesWorkpiece Size
3-6 InchesGrinding Wheel Speed
0-4500rpm AdjustableWafer Center Positioning Accuracy
≤±0.1mmVacuum Chuck Repeatability
≤±0.01mmMinimum Vacuum Disc Movement Step
<±0.01mmGrinding Speed
1mm/S-50mm/SAdhesion Force
Better Than -80kpaMain Motor Speed
0-90rpmTransport Package
CustomSpecification
1560x700x940mmTrademark
N/AOrigin
ChinaKey features
High Precision Control: Precisely controls chamfer angle, size, and surface roughness with CNC system.
Wide Wafer Compatibility: Processes various wafer sizes from 3 to 6 inches and different materials.
Adjustable Grinding Speed: Grinding speed ranges from 1mm/S to 50mm/S for versatile processing needs.
Semi-Automatic Operation: Requires only manual loading and unloading; grinding is fully automatic.
1-Year Warranty Coverage: Includes comprehensive warranty protection for the entire machine.
Multiple Certifications: Certified with GS, CE, and ISO standards for safety and quality.
Fast Lead Time: Average lead time is within 15 workdays regardless of season.
Company profile
Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤2.07hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
About Our Factory & Business Background
AddressXinian Center, No. 1, Helu Road, Nanjing, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsPlate Heat Exchanger, Heat Exchanger, Shell and Tube Heat Exchanger, Fin Heat Exchanger, Finned Tube
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Product Q&A
Q:What is the warranty period for this machine?
A:
The machine comes with a 1-year warranty.
Q:What wafer sizes can this equipment process?
A:
It accommodates wafer sizes ranging from 3 to 6 inches.
Q:Is the operation fully automatic?
A:
No, it is semi-automatic. It requires manual loading and unloading, but the grinding process is automatic.
Q:What certifications does the machine have?
A:
The machine holds GS, CE, and ISO certifications.
Q:What is the maximum grinding speed?
A:
The grinding speed is adjustable from 1mm/S to 50mm/S.
Send Inquiry
*To:
Nanjing Bangwin Thermal Equipment Co., Ltd.
Nanjing Bangwin Thermal Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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