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Semiconductor Wafer Grinding Machine for Ultra Thin Wafer
US$6,500.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
AvailableWarranty
1 YearModel NO.
bwCertification
ISO, CECondition
NewVoltage
380VApplication
Metal CoilPower (Kw)
1.5Weight (Kg)
600Machining Accuracy
High PrecisionGrinding Wheel Speed
60 (Rpm)Maximum Grinding Size
110 (mm)Control Method
CNCTransport Package
CustomSpecification
700*950*1950mmTrademark
N/AOrigin
ChinaCompany profile
Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤3.01hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
About Our Factory & Business Background
AddressXinian Center, No. 1, Helu Road, Nanjing, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsPlate Heat Exchanger, Heat Exchanger, Shell and Tube Heat Exchanger, Fin Heat Exchanger, Finned Tube
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:
Nanjing Bangwin Thermal Equipment Co., Ltd.
Nanjing Bangwin Thermal Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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