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Silicon Wafer Double Side Grinding Machine for IC Wafer
US$7,000.00
1-2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableAfter-sales Service
AvailableWarranty
1 YearModel NO.
bwType
Double Side Lapping MachineAbrasives
Grinding WheelControlling Mode
CNCAutomatic Grade
AutomaticCylindrical Grinder Type
Universal Cylindrical GrinderPrecision
High PrecisionCertification
GS, CE, RoHS, ISO 9001Condition
NewPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Transport Package
CustomSpecification
1700*1300*2170(mm)Trademark
N/AOrigin
ChinaKey features
Integrated Grinding Process: Achieves both rough and fine grinding in a single integrated operation.
Fully Closed-Loop Control: Utilizes PLC, grating ruler, and servo control for precise thickness management.
High Precision Performance: Ensures stable operation with high processing accuracy for silicon wafers.
Automatic Operation: Features automatic grade with CNC controlling mode for efficiency.
Complete Production Line: Capable of building a complete silicon wafer production line.
Multi-Certification Compliance: Certified with GS, CE, RoHS, and ISO 9001 standards.
1-Year Warranty Coverage: Includes a 1-year warranty period for peace of mind.
Available After-Sales Service: Dedicated after-sales support is available for all units.
Company profile
Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤3.46hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
About Our Factory & Business Background
AddressXinian Center, No. 1, Helu Road, Nanjing, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsPlate Heat Exchanger, Heat Exchanger, Shell and Tube Heat Exchanger, Fin Heat Exchanger, Finned Tube
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Product Q&A
Q:What is the warranty period for this machine?
A:
We provide a 1-year warranty for this silicon wafer grinding machine.
Q:Can this machine build a complete production line?
A:
Yes, it is designed to build a complete silicon wafer production line.
Q:What control system does the machine use?
A:
It adopts a PLC, grating ruler, and servo control system for fully closed-loop control.
Q:What certifications does the equipment have?
A:
The machine holds GS, CE, RoHS, and ISO 9001 certifications.
Q:Is after-sales service available?
A:
Yes, after-sales service is available for this product.
Send Inquiry
*To:
Nanjing Bangwin Thermal Equipment Co., Ltd.
Nanjing Bangwin Thermal Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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