Powered by Made-in-China.com
Silicon Wafer Thinning Machine for Microelectronics
US$7,000.00
1-2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableAfter-sales Service
AvailableWarranty
1 YearModel NO.
bwType
Double Side Lapping MachineAbrasives
Grinding WheelControlling Mode
CNCAutomatic Grade
AutomaticCylindrical Grinder Type
Universal Cylindrical GrinderPrecision
High PrecisionCertification
GS, CE, RoHS, ISO 9001Condition
NewPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Transport Package
CustomSpecification
1700*1300*2170(mm)Trademark
N/AOrigin
ChinaCompany profile
Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤2.08hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
About Our Factory & Business Background
AddressXinian Center, No. 1, Helu Road, Nanjing, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsPlate Heat Exchanger, Heat Exchanger, Shell and Tube Heat Exchanger, Fin Heat Exchanger, Finned Tube
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:
Nanjing Bangwin Thermal Equipment Co., Ltd.
Nanjing Bangwin Thermal Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
High Precision Thinning and Lapping Machine for Silicon Wafers
US$39,999.00-59,999.00
1 Piece(MOQ)
Single Side Micron Precision Surface Lapping Polishing Machine for Silicone Wafer, Ceramics and Optics Substrate
US$23,000.00-25,000.00
1 Piece(MOQ)
High Effective Precision Lapping and Thinning Machine for Sapphire Silicon Ceramic
US$60,000.00-80,000.00
1 Piece(MOQ)
Popular Precision Single-Lapping Machine for Diamond Wafers
US$133,800.00
1 Set(MOQ)
Kd15b China Factory High Precison Lapping Machine for Silicone Wafer
US$8,400.00-10,000.00
1 Piece(MOQ)
5-Axis CNC Tool Grinding Machine in 3c Medical Automobile Naseiko C828 Mini for Micro Tools
US$125,000.00-132,000.00
1 Piece(MOQ)
Acm Grinding Mill Machine for Powder Coating
Negotiable
1 Set(MOQ)
Grinding Machine CNC Thread Grinding Machine CNC Worm Grinding Machine with Siemens System Cast Iron Bed for Automotive Aerospace Mold Industry
US$100,000.00-150,000.00
1 Piece(MOQ)
Naseiko CNC Tool Grinding Machine for Processing Precision Carbide HSS Tools in 3c
US$125,000.00-132,000.00
1 Piece(MOQ)
Afz400 Saw Blade Grinding Machine with Auto Loader for Tct Saw Blade Manufacturing
US$25,000.00-32,000.00
1 unit(MOQ)
Advanced CNC Grinding Machine for Efficient Production and Design Solutions
US$55,000.00-75,000.00
1 Piece(MOQ)
Circular Saw Blade Grinding Machine for Tct Face & Top Angle Sharpening
US$999.00-25,000.00
1 unit(MOQ)
CNC Saw Blade Grinding Machine for Tct Side Angle Sharpening (NS700)
US$999.00-49,000.00
1 unit(MOQ)
High Precision Poleda 618 High-Quality Surface Grinding Machine for Affordable Sale
US$2,850.00-4,880.00
1 set(MOQ)
2026 Accurate Face & Top Angle Sharpening Machine for Carbide Saw Blades
US$12,000.00-26,000.00
1 Piece(MOQ)