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Silicon Wafer Thinning Machine for Semiconductor Industry
US$7,000.00
1-2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableAfter-sales Service
AvailableWarranty
1 YearModel NO.
bwType
Double Side Lapping MachineAbrasives
Grinding WheelControlling Mode
CNCAutomatic Grade
AutomaticCylindrical Grinder Type
Universal Cylindrical GrinderPrecision
High PrecisionCertification
GS, CE, RoHS, ISO 9001Condition
NewPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Transport Package
CustomSpecification
1700*1300*2170(mm)Trademark
N/AOrigin
ChinaCompany profile
Business Type: Manufacturer/FactoryExport Year: 2017-04-17Nearest Port: shanghaiAverage Response Time: ≤3.01hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
About Our Factory & Business Background
AddressXinian Center, No. 1, Helu Road, Nanjing, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsPlate Heat Exchanger, Heat Exchanger, Shell and Tube Heat Exchanger, Fin Heat Exchanger, Finned Tube
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:
Nanjing Bangwin Thermal Equipment Co., Ltd.
Nanjing Bangwin Thermal Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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