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ESD White Tyvek Wafer Interleaf Paper, Surface Resistivity for Semiconductor Wafer Isolation & Storage
US$0.10-1.00
5,000 Pieces

Product specifications

SIZE

Product profile

Material

PE

Application

Semiconductor Packaging Materials

Surface Resistivity

10e8-11

Model NO.

HS-HE1025D

Thickness

0.14/0.16/0.19/0.21/0.275mm

Specification

6/8/12inch

Trademark

HESION

Origin

China

Production Capacity

10000PCS/Day

Company profile

Business Type: Manufacturer/Factory

Send Inquiry

*To:Dongguan Hesion Anti-Static Products Co. Ltd.Dongguan Hesion Anti-Static Products Co. Ltd.
*Content:
0/4000

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