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12-Layer electronic HDI PCB with 94V0 on High Tg Fr-4 Substrate
US$0.90-99.99
1 Piece
Product profile
Customization
AvailableType
Rigid Circuit BoardDielectric
High Tg Fr-4 (Iteq It-180, Tg > 175°c)Model NO.
BIC-476-V3.0Material
Glass Epoxy LaminateApplication
Solar Battery ChargersFlame Retardant Properties
V0Mechanical Rigid
RigidProcessing Technology
Immersion GoldBase Material
Glass Epoxy LaminateInsulation Materials
Fr-4 Substrate with Prepreg LayersBrand
RogersBoard Types
Rigid PCBTest
100% Electrical Test Prior ShipmentType of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etcService Area
Worldwide, GloballyTransport Package
Express BoxedSpecification
257 mm x 171.5 mmTrademark
bichengOrigin
Shenzhen ChinaHS Code
8534009000Production Capacity
360000 Square Meters/YearCompany profile
Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.67h
AI-Powered supplier vetting
SummaryShenzhen Bicheng Electronic Technology Co., Ltd. is a China-based trading company established in 2020, focused on PCB sales and technical development. It offers a broad PCB portfolio and extensive customization services, including sample-, design-, full-, minor-, and flexible customization, plus ODM and OEM services. The supplier reports new products within the past year and serves known brands, but no SDK is available. Export activity is significant, with 90% of sales from exports and 5.5 years of export experience. Production information states 360,000 square meters of PCB output, supported by 50 quality-control staff, although the company reports only nine total employees and is identified as a trading company. Financial records are indicated for 2022–2024, but financial performance cannot be assessed from the provided data. No certification evidence, overseas service network, written complaint-handling procedures, or written corrective-action procedures is provided.
After-Sales capabilityThe supplier has in-stock service capability and accepts FOB, CIF, CFR, and EXW quotation terms, but reports no overseas warehouse, overseas showroom, overseas agent or branch, and no participation in offline trade shows. It also has no written complaint-handling or corrective-action procedures or records, indicating limited documented after-sales infrastructure.
R&D capabilityThe supplier reports at least one new product in the past year, provides ODM services, and offers extensive design customization. However, it reports only one year of total R&D-engineer experience and no available SDK, so innovation capability is supported but not comprehensively demonstrated.
Production capacityThe supplier reports PCB output of 360,000 square meters and 50 quality-control staff, and offers multiple PCB categories including high-frequency, metal-core, multilayer, flexible, and prototype PCBs. However, it is identified as a trading company with nine employees, while outsourcing procedures and manufacturing-capacity contracts are unknown, so the underlying production-control capability is not fully verifiable.
Customization capabilityBoth R&D and design-service records list customization from samples, customization from designs, full customization, minor customization, and flexible customization. The supplier also provides ODM services, giving explicit evidence of broad customization capability.
Client casesThe supplier states that it provides OEM services for well-known brands, which is direct evidence of relevant customer experience. However, no customer names, project details, or independently verifiable case studies are provided.
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