Custom Thickness Options: Available in 15mil, 25mil, 50mil, 75mil and up to 500mil thickness.
Low Dielectric Loss: Ultra-low loss at 10GHz ensures stable signal transmission for RF devices.
High Thermal Conductivity: Twice that of traditional PTFE laminates for efficient heat dissipation.
Thermoset Material Stability: Does not soften upon heating, preventing pad lifting during wire bonding.
Isotropic Thermal Expansion: Well-matched with copper to reduce deformation and improve yield.
No Special Pretreatment: Simplifies fabrication process compared to conventional PTFE materials.
Immersion Gold Finish: Provides excellent conductivity, oxidation resistance, and solderability.
High Reliability Applications: Ideal for chip testers, GPS antennas, and satellite communication systems.