F4btms300 Laminate for Printed Circuit Board PCB of Shenzhen Bicheng Electronics

Name: F4btms300 Laminate for Printed Circuit Board PCB of Shenzhen Bicheng Electronics
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1982656961

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$0.99

1 PCS

Product profile

Customization

Available

Structure

Multilayer Rigid PCB

Dielectric

F4btms300 Laminate

Model NO.

BIC-1672-V2.1

Material

Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE

Application

Communication

Flame Retardant Properties

Processing Technology

Electrolytic Foil

Production Process

Subtractive Process

Base Material

Copper

Insulation Materials

Epoxy Resin

Brand

Wangling

Copper Weight

0.5oz, 1oz or 2 Oz

Soldermask Color

Blcak, Blue, Yellow, Red, Green...

Surface Finish

Bare Copper, HASL, Enig, Immersion Silver, etc.

Layer Count

Single-Sided, Double-Sided, Multilayer, and Hybrid

Transport Package

Packing

Specification

≤ 400mm X 500mm

Trademark

Bicheng

Origin

China

HS Code

8534009000

Production Capacity

10000PCS/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.60h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.