High-Frequency Tmm10I 2-Layer PCB Board for RF

Name: High-Frequency Tmm10I 2-Layer PCB Board for RF
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1967006001

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$0.90-99.99

1 Piece

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

Rogers Tmm10I (Ceramic Thermoset Polymer Composite

Model NO.

BIC-1083-V3.0

Material

Rogers Tmm10I Laminate

Application

Satellite Communication Systems

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Immersion Tin

Base Material

Rogers Tmm10I Laminate

Insulation Materials

Ceramic Thermoset Polymer Composite

Brand

Rogers

Board Types

Rigid PCB

Test

100% Electrical Test Prior Shipment

Type of Artwork to Be Supplied

Email File, Gerber RS-274-X, PCB.Doc etc

Service Area

Worldwide, Globally

Transport Package

Shipping Vacuum Packaging

Specification

155.1mm × 168.12mm (±0.15mm, 12 panel

Trademark

bicheng

Origin

Shenzhen China

HS Code

8534009000

Production Capacity

360000 Square Meters/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.38h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.