RO4360g2 High-Dk PCB - 24mil (0.61mm) Double-Layer with Via-in-Pad Technology Using in Base Station Power Amplifiers

Name: RO4360g2 High-Dk PCB - 24mil (0.61mm) Double-Layer with Via-in-Pad Technology Using in Base Station Power Amplifiers
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1977401211

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$99.00

1-99 Pieces

US$0.99

100+ Pieces

Sample price:US$0.99/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

RO4360g2

Model NO.

BIC-1318-V1.0

Material

Fiberglass Epoxy

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Hydrocarbon Resin

Model

PCB

Brand

Rogers/Taconic/Wangling

Board Types

Rigid PCB

Test

100% Electrical Test Prior Shipment

Type of Artwork to Be Supplied

Email File, Gerber RS-274-X, PCB.Doc etc

Service Area

Worldwide, Globally

Transport Package

Packing

Specification

≤ 400mm X 500mm

Trademark

Bicheng

Origin

China

HS Code

8534009000

Production Capacity

10000PCS/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.17h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.