Rogers RO3003 Laminate 6-Layer RF PCB Bonded by Fastrise-28 Prepreg for High Speed Signal Transmission

Name: Rogers RO3003 Laminate 6-Layer RF PCB Bonded by Fastrise-28 Prepreg for High Speed Signal Transmission
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1966199881

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$99.00

1-99 Pieces

US$0.99

100+ Pieces

Sample price:US$0.99/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

RO3003+Fastrise-28

Model NO.

BIC-086-V1.0

Material

Fiberglass Epoxy

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Aluminum

Insulation Materials

Hydrocarbon Resin

Model

PCB

Brand

Rogers

Tihickness

8mil, 10mil, 12mil, 20mil, 32mil and 60mil

Soldermask Color

Blcak, Blue, Yellow, Red, Green...

Copper Weight

0.5oz, 1oz, 2oz

Transport Package

Packing

Specification

≤ 400mm X 500mm

Trademark

Bicheng

Origin

China

HS Code

8534009000

Production Capacity

10000PCS/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.60h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.