Rogers RO4003c and Tg170 Fr-4 6.8mm 6-Layer Multilayer PCB Circuit Board

Name: Rogers RO4003c and Tg170 Fr-4 6.8mm 6-Layer Multilayer PCB Circuit Board
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1975344581

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$99.99

1-99 PCS

US$0.90

100+ PCS

Sample price:US$0.90/pcs.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

Rogers RO4003c

Model NO.

BIC-1430-V2.1

Material

Hydrocarbon/Ceramic Epoxy/Glass

Application

Communication

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Epoxy Resin

Brand

Rogers

Surface Finish

Immersion Gold

Layer Count

6 Layers

Solder Mask

Silkscreen

Transport Package

Kk Paper, 3-Layer Wrinkle

Specification

495mm x 345mm per piece, +/- 0.15mm

Trademark

Bicheng

Origin

Shenzhen China

HS Code

8534009000

Production Capacity

360000 Square Meters/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.67h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.