Rogers Tmm3 20mil High Frequency PCB Double-Layer RF Microwave PCB

Name: Rogers Tmm3 20mil High Frequency PCB Double-Layer RF Microwave PCB
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1965409721

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$99.99

1-99 PCS

US$0.90

100+ PCS

Sample price:US$0.90/pcs.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

Rogers Tmm3

Model NO.

BIC-156-V2.1

Material

Ceramic, Hydrocarbon, Thermoset Polymer Composites

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Immersion Gold

Base Material

Rogers Tmm3

Insulation Materials

Epoxy Resin

Model

PCB

Brand

Rogers

Thickness

20mil

Layer Count

Double Layer

Application

Stripline and Microstrip

Surface Finish

Immersion Gold

Transport Package

Kk Paper, 3-Layer Wrinkle

Specification

≤ 400mm X 500mm

Trademark

Bicheng

Origin

Shenzhen China

HS Code

8534009000

Production Capacity

360000 Square Meters/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.35h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.