Industry-Leading Low Loss: Dissipation factor of 0.0011 at 10 GHz ensures superior signal integrity.
High Thermal Conductivity: 0.65 W/m*K thermal conductivity efficiently dissipates heat in high-power applications.
Low Fiberglass Content: Approximately 5% fiberglass content allows for complex multilayer fabrication.
Dimensional Stability: Low coefficient of thermal expansion ensures reliability under significant thermal cycling.
Customizable Solder Mask: Available in Green, Black, Blue, Yellow, Red, and other colors.
Versatile Surface Finish: Options include Immersion Gold, HASL, Immersion Silver, ENEPIG, OSP, and Bare Copper.
High Power Suitability: Ideal for demanding applications like phased array antennas and radar manifolds.