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Tms-Ds3 Double-Sided Copper Clad Laminate Raw Materials for Fabricate Multi-Layer, Hybrid PCB
US$0.99
1 Piece
Sample price:US$0.99/piece.Request sample
Product profile
Customization
AvailableType
Rigid Circuit BoardDielectric
Tms-Ds3Model NO.
BIC-1525-V1.0Material
Fiberglass EpoxyFlame Retardant Properties
V0Mechanical Rigid
RigidProcessing Technology
Electrolytic FoilBase Material
AluminumInsulation Materials
Hydrocarbon ResinBrand
RogersTihickness
8mil, 12mil, 20mil, 32mil and 60milSoldermask Color
Blcak, Blue, Yellow, Red, Green...Transport Package
PackingSpecification
≤ 400mm X 500mmTrademark
BichengOrigin
ChinaHS Code
8534009000Production Capacity
10000PCS/YearKey features
Exceptional Low-Loss Properties: Dissipation factor of 0.0011 at 10 GHz ensures high-frequency performance.
High Thermal Conductivity: 0.65 W/m*K thermal conductivity effectively dissipates heat from heat sources.
Dimensional Stability: Ceramic-filled reinforced material with minimal fiberglass content for stability.
Low Coefficient of Thermal Expansion: Suitable for demanding thermal cycling requirements in high-power applications.
Multi-Layer Fabrication Capability: Supports single, double, multi-layer, and hybrid PCB designs.
Customizable Dielectric Thickness: Available in 5mil, 10mil, 20mil, 30mil, 60mil, and 90mil options.
Customizable Soldermask Colors: Options include Green, Black, Blue, Yellow, Red, and more.
Diverse Surface Finish Options: Includes Immersion gold, HASL, ENEPIG, OSP, and Pure gold.
Company profile
Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.75h
AI-Powered supplier vetting
SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.
After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.
Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.
R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.
Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.
Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.
Product Q&A
Q:What is the dissipation factor of TSM-DS3?
A:
The dissipation factor is 0.0011 at 10 GHz.
Q:What is the thermal conductivity of this material?
A:
It has a thermal conductivity of 0.65 W/m*K.
Q:What dielectric thickness options are available?
A:
Available thicknesses include 5mil, 10mil, 20mil, 30mil, 60mil, and 90mil.
Q:Can the soldermask color be customized?
A:
Yes, colors such as Green, Black, Blue, Yellow, and Red are available.
Q:Is OEM and ODM service available?
A:
Yes, both OEM and ODM services are available.
Send Inquiry
*To:
Shenzhen Bicheng Electronic Technology Co., Ltd
Shenzhen Bicheng Electronic Technology Co., Ltd*Content:
Supplier replies will be sent to your registered email
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