Wangling F4btm350 2-Layer PCB 3.1mm Immersion Gold Dk3.50 PCB Board Design

Name: Wangling F4btm350 2-Layer PCB 3.1mm Immersion Gold Dk3.50 PCB Board Design
Brand: Shenzhen Bicheng Electronic Technology Co., Ltd
SKU: 1987112651

Guangdong, ChinaShenzhen Bicheng Electronic Technology Co., Ltd

US$0.90-99.99

1 PCS

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

PTFE Fiberglass

Model NO.

BIC-1647-V3.0

Material

PTFE Fiberglass

Application

Phase Shifters

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Enig

Base Material

PTFE Fiberglass

Insulation Materials

PTFE Fiberglass

Brand

Wangling

Board Types

Rigid PCB

Test

100% Electrical Test Prior Shipment

Type of Artwork to Be Supplied

Email File, Gerber RS-274-X, PCB.Doc etc

Service Area

Worldwide, Globally

Transport Package

Vacuum Packaging

Specification

328mm × 84.08mm = 1PCS,

Trademark

Bicheng

Origin

Shenzhen China

HS Code

8534009000

Production Capacity

360000 Square Meters/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryIn-stock CapacityR&D Capabilities

Shenzhen Bicheng Electronic Technology Co., Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5.5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.33h

AI-Powered supplier vetting

SummaryShenzhen Bicheng Electronic Technology Co., Ltd, founded in 2020, operates from Shenzhen, China, as a trading company specializing in circuit boards. It offers a wide range of PCB products and services, including customization and OEM services for popular brands. Despite a strong export focus, it lacks overseas infrastructure and has limited trade show engagement. The company demonstrates innovation capability with recent new product introductions and ODM services. However, its after-sales service capabilities are not well-documented. Financially, it reports consistent capacity over recent years but lacks explicit certifications for quality assurance.

After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and corrective actions, indicating a potential weakness in after-sales services.

Financial creditThe supplier shows consistent financial capacity over the last three years, suggesting stable financial credibility.

R&D capabilityThe supplier demonstrates innovation through recent new product introductions and offers ODM services.

Production capacityThe supplier reports an annual production output between US$10 million and US$50 million, with a large capacity for PCB production.

Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.