Energy Saving XPS Aluminium Foil Underfloor Heating Panel for Electric Floor Heating

Name: Energy Saving XPS Aluminium Foil Underfloor Heating Panel for Electric Floor Heating
Brand: Nanjing Banarta New Materials Co., Ltd.
SKU: 2156864442

Jiangsu, ChinaNanjing Banarta New Materials Co., Ltd.

US$3.60-8.50

1,000 Square Meters

Sample price:US$0.00/piece.Request sample

Product profile

After-sales Service

24 Hours Online Service

Warranty

5 Years

Certification

EAC, TUV, GOST, ISO9001, ROHS, CE

Model NO.

Underfloor Heating Panel

Heating Type

Water Heating Systems

Panel Dimension

1200mm*600mm

Thickness

25mm-50mm Available

Aluminum Thickness

Customized According to Request If Needed

Applied Pipe Diameter

φ16mm

Thermal Conductive

About 0.028 W/M.K

Based Board(XPS)Color

Blue / Yellow / White

Compressive Strength

≥300kpa

Fire Rating

B1,B2,B3

Working Temperature

-30℃-80℃

Transport Package

International Standards

Specification

Standard Specifications or Customized

Trademark

BANARTA

Origin

Jiangsu, China

Production Capacity

500000sqm/Year

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceR&D CapabilitiesPrivate Mold

Nanjing Banarta New Materials Co., Ltd.

Jiangsu, China

CertifiedBusiness Type: Trading Company CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 8 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤0.58h CertifiedTerms of Payment: LC, T/T, D/P, etc.

AI-Powered supplier vetting

SummaryThe supplier manufactures multiple XPS and foam-panel products, reporting annual output of 300,000 XPS foam boards, 800,000 square meters of XPS tile backer board, 300,000 square meters of XPS underfloor heating panels, and 300,000 square meters of foam core sandwich panels. It reports eight years of export experience, in-stock capability, and broad customization options. The supplier claims CE and ISO certifications and exports to several global regions, but the provided information does not include certificate details. After-sales tracking and complaint procedures are described, although complaint records are not documented. Innovation evidence is limited to one new product in the past year, one R&D engineer, and no ODM, SDK, or 3D design services. Quality-control evidence is weak because quality assurance and traceability status are unknown and the stated quantity of quality-testing equipment is zero. Financial information is insufficient for assessment.

Supplier typeThe supplier is a manufacturer of XPS foam boards, tile backer boards, underfloor heating panels, and foam core sandwich panels, with stated production volumes and eight years of export experience. It is not identified as a professional technical supplier, and it lacks overseas warehouses, showrooms, and overseas agents or branches.

CertificationsThe supplier states that its products have passed international certifications including CE and ISO and are exported to Europe, America, Southeast Asia, and the Middle East. However, no certificate numbers, scopes, or validity details are provided.

After-Sales capabilityThe supplier describes full-process order, logistics, and after-sales tracking, with a responsive after-sales team, and reports a complaint-handling procedure. The complaint procedure has no written records, while service-capability procedures and corrective/preventive actions also lack records, limiting documented reliability.

Production capacityThe supplier reports substantial annual output across four product categories, inventory capability, and an off-season average lead time within 15 working days. These stated capacities support a positive production assessment, although the slices do not independently verify the figures.

Customization capabilityThe supplier explicitly offers customization from samples and designs, full, minor, and flexible customization, including product size, thickness, density, surface treatment, packaging, and logos. Its R&D role is also described as customizing according to customer needs, despite the absence of 3D software design services.