What mounting style is used?

The sensors use a Through Hole mounting style in a SIP-4 package/case.

What is the pressure port size?

The port size is 0.25 inches with a dual axial barbed design on opposite sides.

Honeywell 24PCCFA6D Miniature Low Pressure Sensors 24PC Series

Name: Honeywell 24PCCFA6D Miniature Low Pressure Sensors 24PC Series
Brand: BNSENS Co., Ltd.
SKU: 2170686555

Jiangsu, ChinaBNSENS Co., Ltd.

US$1.00-199.00

1 Piece

Sample price:US$50.00/piece.Request sample

Product profile

Customization

Available

Output Signal Type

Analog Type

Certification

RoHS

Model NO.

24PCCFA6D

Manufacturer

Honeywell

Product Category

Board Mount Pressure Sensors

Pressure Type

Vacuum, Gauge, Differential

Seal Material

Fluorosilicone

Pressure Port Type

Straight

Operating Pressure

15 psi

Operating Supply Voltage

10 Vdc Typ.

Operating Temperature

-20 ℃ to 85 ℃

Accuracy

0.5 %

Mounting Style

Through Hole

Package / Case

SIP-4

Port Type

Dual Axial Barbed, Opposite Sides

Port Size

0.25 in

Transport Package

Carton

Trademark

Honeywell

Key features

High Accuracy MEMS Technology: Uses specialized piezoresistive micromachined element with 0.5% accuracy.

Wet/Wet Media Capability: Supports liquids on both ports with compatible PPA plastics and seals.

Flexible Excitation Modes: Can be excited with constant current or constant voltage for design flexibility.

RoHS Compliant: Manufactured according to ISO 9001 standards and RoHS compliant.

Multiple Package Options: Available in SIP, DIP, SMT, and flow-through package styles.

Broad Pressure Range: Accommodates pressures from 0.5 psi to 250 psi for various needs.

Dual Axial Port Design: Features dual axial barbed ports on opposite sides for easy installation.

Company profile

Importers and ExportersFast DeliveryQuality Assurance100% Finished Products Inspection

BNSENS Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryAverage Response Time: ≤2.50h

AI-Powered supplier vetting

SummaryBNSENS Co., Ltd. is identified as a Chinese manufacturer/factory in Jiangsu specializing in sensors and transmitters for pressure, level, temperature, flow, current, switching, and position applications. The supplier describes MEMS and independently developed ASIC expertise, a U.S.-based R&D center, and supply or cooperation relationships involving Emerson, SICK, TSMC, Siemens, Infineon, and Rohm. Its products are reported as serving multiple industrial sectors, and an audit was conducted by BV; however, the audit result and type are provided only as codes, so certification or compliance conclusions cannot be made. Information on after-sales service, financial credibility, quality systems, customization, sustainability, and several R&D services is insufficient. The stated registered capital is omitted from this assessment for privacy.

Supplier typeThe supplier is explicitly identified as a Manufacturer/Factory and a high-tech enterprise specializing in sensor development, manufacturing, and trade. Its stated business scope is Electrical & Electronics, and its listed products cover multiple sensor and transmitter categories.

R&D capabilityBNSENS describes a sensor R&D center in Minnesota, core MEMS-chip technology, independently developed ASIC chips, German-origin production-line introduction, and development of additional industrial-control sensors. These statements provide explicit evidence of R&D and technology activity, although the scope and verification of the capabilities are not further documented.

Production capacityThe supplier is classified as a factory and states that it develops and manufactures a broad range of sensor products. Its history includes a sensor production-line introduction and factory relocation, while reported use across oil, gas, power, chemical, metallurgy, food, environmental protection, aerospace, and municipal applications supports production experience; actual capacity, equipment scale, and output data are not provided.

Client casesThe supplier reports that its products are used across numerous industries and cites relationships or sales involving Emerson, SICK, TSMC, Siemens in Vietnam, Infineon, and Rohm. These are explicit customer or business-cooperation claims, but the slices do not provide project details, order scope, duration, or independently verified case evidence.