What media are compatible with this sensor?

It accommodates wet and dry media compatible with polyphthalamide (PPA) plastics and fluorosilicone seals.

What is the port type?

The port type is an M5 thread port.

Honeywell Miniature Low Pressure Sensors 26PC Series 26PCFFH2G

Name: Honeywell Miniature Low Pressure Sensors 26PC Series 26PCFFH2G
Brand: BNSENS Co., Ltd.
SKU: 2172612205

Jiangsu, ChinaBNSENS Co., Ltd.

US$1.00-199.00

1 Piece

Sample price:US$50.00/piece.Request sample

Product profile

Customization

Available

Output Signal Type

Analog Type

Certification

RoHS

Model NO.

26PCFFH2G

Manufacturer

Honeywell

Subcategory

Sensors

Product Category

Board Mount Pressure Sensors

Series

26PC Series

Pressure Type

Vacuum, Gauge

Operating Pressure

100 psi

Accuracy

0.4 %

Operating Supply Voltage

10 V

Storage Temperature

-40 °C to 85 °C

Mounting Style

Through Hole

Port Type

M5 thread port

Package / Case

DIP-4

Seal Material

Fluorosilicone

Condition

Original New

Transport Package

Carton

Trademark

Honeywell

Key features

High Precision Accuracy: Features 0.4% accuracy with piezoresistive micromachined sensing element.

Wide Pressure Range: Accommodates pressures from 1 psi to 250 psi for versatile applications.

RoHS Compliant Design: Manufactured according to ISO 9001 standards and RoHS compliant.

Compact DIP-4 Package: Miniature through-hole mounting with M5 thread port for easy integration.

Analog Output Signal: Provides milliVolt output signal proportional to input pressure.

Chemical Resistance: Compatible with wet/dry media using PPA plastics and fluorosilicone seals.

Low Power Consumption: Designed for low power operation with 10 V operating supply voltage.

Company profile

Importers and ExportersFast DeliveryQuality Assurance100% Finished Products Inspection

BNSENS Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryAverage Response Time: ≤2.51h

AI-Powered supplier vetting

SummaryBNSENS Co., Ltd. is identified as a Chinese manufacturer/factory in Jiangsu specializing in sensors and transmitters for pressure, level, temperature, flow, current, switching, and position applications. The supplier describes MEMS and independently developed ASIC expertise, a U.S.-based R&D center, and supply or cooperation relationships involving Emerson, SICK, TSMC, Siemens, Infineon, and Rohm. Its products are reported as serving multiple industrial sectors, and an audit was conducted by BV; however, the audit result and type are provided only as codes, so certification or compliance conclusions cannot be made. Information on after-sales service, financial credibility, quality systems, customization, sustainability, and several R&D services is insufficient. The stated registered capital is omitted from this assessment for privacy.

Supplier typeThe supplier is explicitly identified as a Manufacturer/Factory and a high-tech enterprise specializing in sensor development, manufacturing, and trade. Its stated business scope is Electrical & Electronics, and its listed products cover multiple sensor and transmitter categories.

R&D capabilityBNSENS describes a sensor R&D center in Minnesota, core MEMS-chip technology, independently developed ASIC chips, German-origin production-line introduction, and development of additional industrial-control sensors. These statements provide explicit evidence of R&D and technology activity, although the scope and verification of the capabilities are not further documented.

Production capacityThe supplier is classified as a factory and states that it develops and manufactures a broad range of sensor products. Its history includes a sensor production-line introduction and factory relocation, while reported use across oil, gas, power, chemical, metallurgy, food, environmental protection, aerospace, and municipal applications supports production experience; actual capacity, equipment scale, and output data are not provided.

Client casesThe supplier reports that its products are used across numerous industries and cites relationships or sales involving Emerson, SICK, TSMC, Siemens in Vietnam, Infineon, and Rohm. These are explicit customer or business-cooperation claims, but the slices do not provide project details, order scope, duration, or independently verified case evidence.