What media can be used with this sensor?

It is intended for non-corrosive, non-ionic gases like air, or liquids if the silicone gel coating option is selected.

Honeywell TBPDANS150PGUCV TBP SERIES Basic Board Mount Pressure Sensors

Name: Honeywell TBPDANS150PGUCV TBP SERIES Basic Board Mount Pressure Sensors
Brand: BNSENS Co., Ltd.
SKU: 2202118925

Jiangsu, ChinaBNSENS Co., Ltd.

US$1.00-699.00

1 Piece

Sample price:US$25.00/piece.Request sample

Product profile

Customization

Available

Type

Piezoresistive Pressure Sensor

Manufacturer

Honeywell

Model NO.

TBPDANS150PGUCV

Product Category

Board Mount Pressure Sensors

Pressure Type

Gage

Presure Port

Single Axial Barbed Port

Operating Pressure

0 psi to 150 psi

Accuracy

±0.25 %FSS BFSL

Package / Case

Leadless SMT

Operating temperature range

-40 °C to +125 °C

Output

Unamplified

Compensation

Compensated

Gel Coating

Silicone Gel Coating in Media Path (Food Grade)

Transport Package

Carton

Trademark

Honeywell

Key features

Food Grade Certification: NSF-169, BPA Free, and LFGB certified with silicone gel coating for food safety.

Compact SMT Package: Leadless SMT package size as small as 7 mm x 7 mm for easy PCB integration.

Temperature Compensated: TBP series offers compensated output to minimize system calibration needs.

Versatile Applications: Suitable for medical (blood pressure) and industrial (HVAC, pneumatic) uses.

Robust Durability: Withstands 1 million pressure cycles and meets MIL-STD vibration/shock specs.

Cost-Effective Solution: Smaller footprint and competitive pricing simplify device manufacturing.

Company profile

Importers and ExportersFast DeliveryQuality Assurance100% Finished Products Inspection

BNSENS Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryAverage Response Time: ≤3.04h

AI-Powered supplier vetting

SummaryBNSENS Co., Ltd. is identified as a Chinese manufacturer/factory in Jiangsu specializing in sensors and transmitters for pressure, level, temperature, flow, current, switching, and position applications. The supplier describes MEMS and independently developed ASIC expertise, a U.S.-based R&D center, and supply or cooperation relationships involving Emerson, SICK, TSMC, Siemens, Infineon, and Rohm. Its products are reported as serving multiple industrial sectors, and an audit was conducted by BV; however, the audit result and type are provided only as codes, so certification or compliance conclusions cannot be made. Information on after-sales service, financial credibility, quality systems, customization, sustainability, and several R&D services is insufficient. The stated registered capital is omitted from this assessment for privacy.

Supplier typeThe supplier is explicitly identified as a Manufacturer/Factory and a high-tech enterprise specializing in sensor development, manufacturing, and trade. Its stated business scope is Electrical & Electronics, and its listed products cover multiple sensor and transmitter categories.

R&D capabilityBNSENS describes a sensor R&D center in Minnesota, core MEMS-chip technology, independently developed ASIC chips, German-origin production-line introduction, and development of additional industrial-control sensors. These statements provide explicit evidence of R&D and technology activity, although the scope and verification of the capabilities are not further documented.

Production capacityThe supplier is classified as a factory and states that it develops and manufactures a broad range of sensor products. Its history includes a sensor production-line introduction and factory relocation, while reported use across oil, gas, power, chemical, metallurgy, food, environmental protection, aerospace, and municipal applications supports production experience; actual capacity, equipment scale, and output data are not provided.

Client casesThe supplier reports that its products are used across numerous industries and cites relationships or sales involving Emerson, SICK, TSMC, Siemens in Vietnam, Infineon, and Rohm. These are explicit customer or business-cooperation claims, but the slices do not provide project details, order scope, duration, or independently verified case evidence.