Tsp-H Intelligent Temperature Transmitter Hersman Circuit Board

Name: Tsp-H Intelligent Temperature Transmitter Hersman Circuit Board
Brand: BNSENS Co., Ltd.
SKU: 2147795355

Jiangsu, ChinaBNSENS Co., Ltd.

US$30.00-50.00

1 Piece

Sample price:US$30.00/piece.Request sample

Product profile

Customization

Available

Measuring Medium

Temperature

Certification

Model NO.

TSP-H

Customized

Supply Voltage

12VDC~32VDC

Output Type

4mA~20mA Two-Wire System +Hart

ADC Resolution

0.001%Fs

The Stability of PT100

0.01℃

Size

Length 38.1* Width 19.1mm

Hole Distance

13mm

Transport Package

Carton

Origin

China

Production Capacity

100000

Company profile

Importers and ExportersFast DeliveryQuality Assurance100% Finished Products Inspection

BNSENS Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/FactoryAverage Response Time: ≤2.69h

AI-Powered supplier vetting

SummaryBNSENS Co., Ltd. is identified as a Chinese manufacturer/factory in Jiangsu specializing in sensors and transmitters for pressure, level, temperature, flow, current, switching, and position applications. The supplier describes MEMS and independently developed ASIC expertise, a U.S.-based R&D center, and supply or cooperation relationships involving Emerson, SICK, TSMC, Siemens, Infineon, and Rohm. Its products are reported as serving multiple industrial sectors, and an audit was conducted by BV; however, the audit result and type are provided only as codes, so certification or compliance conclusions cannot be made. Information on after-sales service, financial credibility, quality systems, customization, sustainability, and several R&D services is insufficient. The stated registered capital is omitted from this assessment for privacy.

Supplier typeThe supplier is explicitly identified as a Manufacturer/Factory and a high-tech enterprise specializing in sensor development, manufacturing, and trade. Its stated business scope is Electrical & Electronics, and its listed products cover multiple sensor and transmitter categories.

R&D capabilityBNSENS describes a sensor R&D center in Minnesota, core MEMS-chip technology, independently developed ASIC chips, German-origin production-line introduction, and development of additional industrial-control sensors. These statements provide explicit evidence of R&D and technology activity, although the scope and verification of the capabilities are not further documented.

Production capacityThe supplier is classified as a factory and states that it develops and manufactures a broad range of sensor products. Its history includes a sensor production-line introduction and factory relocation, while reported use across oil, gas, power, chemical, metallurgy, food, environmental protection, aerospace, and municipal applications supports production experience; actual capacity, equipment scale, and output data are not provided.

Client casesThe supplier reports that its products are used across numerous industries and cites relationships or sales involving Emerson, SICK, TSMC, Siemens in Vietnam, Infineon, and Rohm. These are explicit customer or business-cooperation claims, but the slices do not provide project details, order scope, duration, or independently verified case evidence.

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Tsp-H Intelligent Temperature Transmitter Hersman Circuit Board