Push Back, De-Icing Full-Duplex Wireless Ground Support Headset

Name: Push Back, De-Icing Full-Duplex Wireless Ground Support Headset
Brand: Xiamen Inbertec Electronic Technology Co., Ltd
SKU: 2250078075

Fujian, ChinaXiamen Inbertec Electronic Technology Co., Ltd

US$659.00-899.00

30 Pieces

Sample price:US$150.00/piece.Request sample

Product profile

Customization

Available

Color

Orange

Type

Electret Earphone

Model NO.

UW6000

Communication

Wireless

Usage

Aviation

Function

Microphone, Waterproof, Noise-Cancelling

Jack Diameter

Wireless

Jack Type

Wlreless

Transport Package

Box

Trademark

Inbertec

Origin

China

Company profile

Xiamen Inbertec Electronic Technology Co., Ltd

Fujian, China

CertifiedBusiness Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2020-11-22 CertifiedNearest Port: Xiamen PortAverage Response Time: ≤3.97h CertifiedTerms of Payment: LC, T/T, D/P, etc.

AI-Powered supplier vetting

SummaryXiamen Inbertec Electronic Technology Co., Ltd, established in 2020, is a Chinese manufacturer specializing in business communication devices. The company operates seven production lines with an annual output between US$5 million and US$10 million. It exports a significant portion of its products globally, primarily to regions such as Africa, Southeast Asia, and North America. The company offers flexible service arrangements and OEM/ODM customization, but lacks certification for its management systems. With a limited number of employees and R&D staff, the company demonstrates moderate production and innovation capabilities.

Supplier typeThe supplier is a manufacturer based in Fujian, China.

CertificationsThe supplier does not hold any management system certifications.

After-Sales capabilityThe supplier provides one-stop support and flexible services, including OEM/ODM customization.

Production capacityThe supplier operates seven production lines with a moderate annual output.

Customization capabilityThe supplier offers OEM/ODM customization with flexible arrangements.