300 Dpi USB Version Print Via Computers PC Mobile Thermal Transfer Label Printer

Name: 300 Dpi USB Version Print Via Computers PC Mobile Thermal Transfer Label Printer
Brand: Guangzhou Bowen Packing Material Co., Ltd
SKU: 2063280712

Guangdong, ChinaGuangzhou Bowen Packing Material Co., Ltd

US$200.00

1-4 Pieces

US$170.00

5-9 Pieces

US$165.00

10+ Pieces

Product profile

Customization

Available

Certification

ISO, ISO9001, CE, MSDS

Transfer Mode

Direct Printing

Model NO.

label printer

Method

Heat Transfer Printing

Usage

Plate, Fabric, Bag, Leather, Cotton, Garment

Resolution

203dpi / 300 Dpi

Label Material

Direct Thermal Labels, Thermal Transfer Labels,

Acceptable Labels

Pet Silver Labels, Synthetic PP Labels, Garment H

TTR Ribbons

Wax Ribbon, Wax-Resin Ribbons, Resin Ribbons,

Thermal Transfer Ribbon

Washable Resin Ribbons

Media Type

Continuous Paper, Gap Paper, Folded Paper Black Ma

Available Version

USB / Bluetooth / WiFi/Ethernet

Printer Dimension

280X220X168mm(Lwh)

Print Width 1

15~104mm

Print Width 2

15~108mm

Print Speed 1

152mm/S, 127mm/S

Media Width Max

118mm

Packaging

Paper Cartons or Customized Packaging

Max Ribbon Size

110mm * 300m

Media O.D. Max.

130m

Transport Package

Carton

Specification

Customized Size

Trademark

BW or customized logo

Origin

China

HS Code

8443321900

Production Capacity

50000 Pieces / Month

Company profile

Importers and ExportersFast DeliveryQuality AssuranceProduction Process Visualization

Guangzhou Bowen Packing Material Co., Ltd

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Flexible customization CertifiedExport Year: 1 Year CertifiedNearest Port: Guangzhou PortAverage Response Time: ≤8.97h

AI-Powered supplier vetting

SummaryThe supplier demonstrates ODM availability, sample-based and flexible customization, documented quality-control, corrective-action, complaint-handling, and traceability procedures. It reports inventory capability, export rights, accepted international trade and payment terms, and lead times within 15 working days in both peak and off-peak seasons. However, evidence also shows no SDK, no OEM service for popular brands, no overseas agents, branches, warehouse, showroom, or offline trade-show participation. Manufacturing controls have notable gaps: no valid contract with related subcontractors, no continuous quantity reconciliation, and no outsourcing SOP. Financial information is present for selected years, but it does not establish financial strength or credibility. Production data is inconsistent between the reported single production line and the company description of 17 fully automatic lines.

Supplier typeThe supplier provides ODM service, flexible customization, inventory service, export rights, and manufacturing capacity. It does not provide popular-brand OEM services and has no overseas agents, branches, warehouses, or showrooms, indicating a manufacturer-oriented supplier with limited overseas service infrastructure.

After-Sales capabilityThe supplier has a clear, recorded procedure for handling customer complaints and corrective/preventive actions, which supports after-sales issue management. However, it lacks overseas agents, branches, warehouses, and showrooms, limiting demonstrated local after-sales coverage.

Production capacityThe supplier reports inventory capability, a thermal-transfer-ribbon output of 75,000,000 square meters, and lead times within 15 working days. Nonetheless, production-line information conflicts materially: one line is reported in manufacturing records while the company description states 17 fully automatic coating and cutting lines; quantity reconciliation and outsourcing SOPs are also absent.

Customization capabilityThe supplier explicitly offers ODM service and customization from samples with flexible customization. This is direct evidence of customization capability, although the absence of an SDK indicates that customization may not include software-development integration.