Factory Price Horizontal Flow Packing Machine for Biscuit Cookies Bread

Name: Factory Price Horizontal Flow Packing Machine for Biscuit Cookies Bread
Brand: Shanghai Bsp Packaging Machinery Co., Ltd.
SKU: 2146255005

Shanghai, ChinaShanghai Bsp Packaging Machinery Co., Ltd.

US$2,600.00-4,900.00

1 Piece

Product profile

Customization

Available

After-sales Service

in-Door Installation, Online Support

Warranty

1 Year

Model NO.

BSP-Z350

Automatic Grade

Automatic

Application

Cleaning, Detergent, Cosmetics, Drinks, Skin Care Products, Dairy Products, Hair Care Products, Fish, Meat, Snack

Type

Forming Filling Sealing Machine

Forming Species

Bag Moulding

Forming Function

Forming, Filling, Seal

Driven Type

Electric

Material Type

Solid

Packaging

Bag

Packaging Material

Film

Film Moving Direction

Film From Above / Film From Bottom

Control System

Touch Screen + PLC + Servo Motor

Sealing Type

Back Sealing

Bag Length Controlled by

System Control + Photoelectric Tracking

Temperature Control System

Pid

Temperature Control Error Range

1 Dgree Centigrade

Packing Speed

5-230 Bags/Min

Bag Size

L65-330mm; W50-160mm

Film Roll Diameter(Max)

320mm

Film Width(Max)

350mm

Voltage

AC220V 50Hz

Power

2.6kw

Weight

400kg

Dimension

L4020*W770*H1410mm

Transport Package

Wooden Case

Specification

2.5CBM

Trademark

BSP

Origin

Shanghai, China

HS Code

8422303090

Production Capacity

1000 PCS/Month

Company profile

Shanghai Bsp Packaging Machinery Co., Ltd.Shanghai, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2024-05-14Nearest Port: Shanghai, NingboAverage Response Time: ≤2.83hTerms of Payment: T/T, PayPalInternational Commercial Terms(Incoterms): FOB, EXW, CIF, DAP, CIP, FCA

AI-Powered supplier vetting

SummaryThe supplier operates in general equipment manufacturing, mechanical and electronic equipment sales and maintenance, packaging-related products, and technical services. It reports CE certification and import/export qualification, but the claimed ISO reference is written as “ISO0001/2000” and is not sufficiently clear. Production-related evidence includes inventory capability, one-month peak and off-season lead times, and 100% finished-product inspection, although no valid manufacturing-capacity contract exists with related subcontractors. Customization, ODM, OEM, and sample-based/full customization services are reported, while the supplier states it is not a professional technical supplier, does not provide 3D software design or SDKs, and had no new products in the past year. Financial records are indicated for recent years, but financial performance details are not provided. Customer cases are not specifically identified.

CertificationsThe supplier states that its products have passed European Union CE certification and that it holds an import and export qualification certificate. It also references an “ISO0001/2000 international quality system,” but that wording is unclear and does not establish a specific, verifiable ISO certification.

After-Sales capabilityThe company description mentions after-sales service teams and one-to-one personalized service, while its business scope includes maintenance of electronic and mechanical equipment. However, it reports no overseas warehouse and no overseas showroom, so international after-sales infrastructure is limited in the provided evidence.

Production capacityProduction-related evidence includes general equipment manufacturing, inventory capability, 100% finished-product inspection, written inspection instructions, raw-material traceability, and one-month average lead times in both peak and off-season periods. Nevertheless, the supplier has no valid manufacturing-capacity contract with related subcontractors, which creates a documented capacity-management weakness.

Customization capabilityThe supplier explicitly offers customization from samples, full customization, one-to-one customer-specific equipment development, and ODM services. These multiple statements provide direct evidence of substantial customization capability, despite the absence of 3D software design and SDK support.