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High Performance Aln Aluminium Nitride Metallized Ceramic Substrate for Power Electronics
US$1.00-100.00
10 Pieces
Product profile
Customization
AvailableApplication
Electronic Devices, Lighting, Power Supply, SemiconductorsConductive Layer
Thick Copper LayerModel NO.
CustomizedMaterial
AlNProcess
Direct Bonded CopperThickness
CustomizedFeature
High Current Capacity and Heat DissipationCopper Thickness
100-600umUse Temperature
300-400℃Other Available Material
Al2O3Other Available Process
Mo-Mn MetallizationTransport Package
Vacuum PackagingSpecification
According to the DrawingTrademark
JingHuiOrigin
ChinaHS Code
8547100000Production Capacity
50000 PCS/MonthKey features
Ultra-high Thermal Conductivity: Solves heat dissipation bottlenecks for high-power devices effectively.
Customized Thickness: Thickness can be customized to meet specific application requirements.
Excellent Electrical Insulation: Suitable for high-voltage environments with reliable insulation performance.
High Current Capacity: Features high current carrying capacity ideal for power electronics.
Multiple Metallization Processes: Offers DBC, Thin Film, Thick Film, and AMB processes for diverse needs.
High Reliability Bonding: AMB process provides high bonding strength for critical applications.
Company profile
Business Type: Manufacturer/Factory, Trading Company, Group CorporationExport Year: 2009-03-11Nearest Port: Shenzhen, HongKong, ShanghaiAverage Response Time: ≤2.08hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
About Our Factory & Business Background
Address1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: 1-3 months Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsMetallized Ceramics, Ceramic Substrates, Pepper Mill Mechanism, Pepper Grinder Mechanism, Ceramic Parts, Precision Ceramics, Zirconia Ceramics, Ceramic Insulators, Silicon Nitride Ceramics, Aluminum Nitride Ceamics
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Product Q&A
Q:What is the thickness of the copper layer?
A:
The copper thickness ranges from 100 to 600 micrometers.
Q:Can the substrate thickness be customized?
A:
Yes, the thickness of the substrate is customizable.
Q:What is the maximum operating temperature?
A:
The substrate is designed for use temperatures between 300 and 400 degrees Celsius.
Q:What metallization processes are available?
A:
Available processes include Direct Copper Bonding (DBC), Thin Film Metallization, Thick Film Printing, and Active Metal Brazing (AMB).
Q:Is aluminum oxide available as an alternative material?
A:
Yes, Al2O3 is available as an alternative material.
Send Inquiry
*To:SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED*Content:
Supplier replies will be sent to your registered email
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