What laser power options are available?

Available laser power options are 50W, 70W, and 90W.

What edge quality can I get?

Optimized Scribe & Break process ensures chipping <10um for silicon wafer glass substrates.

Chanxan High Precision Scribe & Break Machine for Silicon Wafer Glass Substrates

Name: Chanxan High Precision Scribe & Break Machine for Silicon Wafer Glass Substrates
Brand: Chanxan (Changshu) Laser Technology Co., Ltd.
SKU: 2290607025

Jiangsu, ChinaChanxan (Changshu) Laser Technology Co., Ltd.

US$85,000.00

1 Set

Product specifications

Purchase Options

Product profile

Customization

Available

After-sales Service

Overseas Technical Support

Warranty

12 Months

Model NO.

CW-6050IPL

Application

Aerospace Industry, Automotive Industry, Semiconductor, Wafer Glass Substrate Processing

Cooling System

Water Cooling

Technical Class

Pulse Laser

Applicable Material

Glass

Structure Type

Gantry Type

Laser Classification

Solid Laser

Laser Technology

Scribe & Break Process

Laser Type

Ultrafast Laser

Laser Power

50W/70W/90W

Working Area

600*800mm

Positioning Accuracy

±3um

Processing Speed

≤1000mm/S

Processing Accuracy

≤30um

Focus Spot

≤20um

Scan Range of Galavanometer

50*50um

Machinery Test Report

Provided

Video Outgoing-Inspection

Provided

Certification

Processing Material

Silicon Wafer Glass Substrate

Processing Material 2

Brittle Optical Glass

Power Supply

AC 380V+10%6, 50Hz/60Hz

Transport Package

Wooden Case

Specification

1800*1600*2200mm

Trademark

CHANXAN

Origin

Suzhou

Production Capacity

100sets/Month

Key features

Ultrafast Infrared Picosecond Laser: Realizes cold-processing technology with minimal Heat-Affected Zone for brittle substrates.

Low-Chipping Scribe & Break Process: Optimized beam shaping delivers smooth edge, chipping <10um for silicon-wafer glass substrates.

Integrated One-Stop Workflow: Automatic loading, scribing, controlled breaking, finished output, no-manual splitting required.

Tailored For Silicon Wafer Glass Substrates: Supports customized processing layout for semiconductor-related glass substrates.

Reliable After-sales Warranty: 12-month warranty for core laser components, spare-parts supplied for non-human damage.

Professional Remote Support: 24/7 remote-video guidance and online technical consultation available.

CE-Certified Equipment: Complies with international safety standards; pre-shipment test & video inspection are available.

Company profile

Cooperated with Fortune 500Experienced TeamManagement CertificationStandardized quality control

Chanxan (Changshu) Laser Technology Co., Ltd.

Jiangsu, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Full Customization, etc. CertifiedNearest Port: Shanghai PortAverage Response Time: ≤0.01h CertifiedTerms of Payment: LC, T/T, D/P, etc.

About Our Factory & Business Background

Address180 Liantang Avenue, Changshu, Suzhou, Jiangsu, China

Plant Area44854.15 square meters

Registered Capital70,000,000 RMB

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsLaser Cutting Machine, Glass Cutting Machine, FPC Cutting Machine, PCB Cutting Machine, Precision Laser Cutting, Cutting Machine, Femtosecond Laser Cutting Machine, Picosecond Laser Cutting Machine, Nanosecond Laser Cutting Machine, Pi Film Laser Cutting

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsHave instructions and uniformly followed

Traceability of Raw MaterialsYes

Our Industry Experience & Global Business Record

Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

Repeat Buyers Choice50%~80%

Number of Foreign Trading Staff48

Overseas Agent/BranchNo

Our Certifications, Standards & Industry Recognition

Product CertificationCE

Cooperated with Fortune 500Yes

Product Q&A

Q:What is the delivery date?

About 35 days after receipt of payment.

Q:Are you a trade company or manufacturer?

We are a professional manufacturer with independent R-D and manufacturing capabilities.

Q:What is the after-sales service?

12-month warranty for core laser components; free spare parts for non-human damage. Remote video technical support is provided. Consumables are not covered under warranty.

Q:Can we be your agent?

We welcome global agents for cooperation. We supply full technical support, after-sales service and favorable agent policies.

Q:What materials can this Scribe & Break machine process?

Mainly for silicon wafer glass substrates and various brittle optical glass, optimized for semiconductor-related glass processing.