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CNC Fiber Laser Scribing & Cutting Machine for Semiconductor Silicon Wafer Processing
US$4,449.00
1 Set

Product specifications

Purchase Options

Product profile

Customization

Available

After-sales Service

Overseas Technical Support

Warranty

12 Months

Model NO.

CW-6060

Application

Aerospace Industry, Automotive Industry, Semiconductor Silicon Wafer Scribing Processing

Cooling System

Water Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Silicon Wafer Substrate

Structure Type

Gantry Type

Laser Classification

Fiber Laser

Laser Technology

Laser Precision Wafer Scribing

Laser Type

Fiber Laser

Laser Power

150W-1500W

Working Area

600*600/1000*800mm

Positioning Accuracy

1um

Processing Speed

5000-25000mm/S

Machinery Test Report

Provided

Video Outgoing-Inspection

Provided

Certification

CE

Power Supply

AC 380V+10%, 50Hz/60Hz

Processing Material

Silicon Wafer

Positioning System

High Precision CCD Visual Auto Positioning System

Machine Frame

Integrated Marble Base Enclosed Gantry Frame

Processing Advantage

Low Edge Chipping Silicon Wafer Micro Scribing

Application Industry

Semiconductor Chip Packaging

Application Industry 2

Aerospace & Automotive Power Semiconductor

Transport Package

Plywood Wooden Case

Specification

1800*1430*1850mm

Trademark

CHANXAN

Origin

Suzhou

Production Capacity

100sets/Month

Company profile

Chanxan (Changshu) Laser Technology Co., Ltd.
Cooperated with Fortune 500Experienced TeamManagement CertificationStandardized quality control
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Full Customization, etc. CertifiedNearest Port: Shanghai PortAverage Response Time: ≤0.04h CertifiedTerms of Payment: LC, T/T, D/P, etc.

About Our Factory & Business Background

Address180 Liantang Avenue, Changshu, Suzhou, Jiangsu, China
Plant Area44854.15 square meters
Registered Capital70,000,000 RMB
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsLaser Cutting Machine, Glass Cutting Machine, FPC Cutting Machine, PCB Cutting Machine, Precision Laser Cutting, Cutting Machine, Femtosecond Laser Cutting Machine, Picosecond Laser Cutting Machine, Nanosecond Laser Cutting Machine, Pi Film Laser Cutting
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
Traceability of Raw MaterialsYes

Our Industry Experience & Global Business Record

Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff48
Overseas Agent/BranchNo

Our Certifications, Standards & Industry Recognition

Management System CertificationISO9001:2015
Product CertificationCE
Cooperated with Fortune 500Yes

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