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High Precision Semiconductor Laser Cutting Machine for Thin Glass & Wafer Processing
US$8,889.00
1 Set
Product specifications
Purchase Options
Product profile
Customization
AvailableAfter-sales Service
Overseas Technical SupportWarranty
12 MonthsModel NO.
CS-0605-V-AApplication
Aerospace Industry, Automotive Industry, Semiconductor Wafer & IC Packaging GlassCooling System
Water CoolingTechnical Class
Pulse LaserApplicable Material
NonmetalStructure Type
Gantry TypeLaser Classification
Solid LaserLaser Technology
Precision Cold CuttingLaser Type
Ultrafast Picosecond LaserLaser Power
10W/30W/35WWorking Area
500*610mmPositioning Accuracy
±1umProcessing Speed
≤3000mm/SProcessing Accuracy
≤30umFocus Spot
≤20umScan Range of Galavanometer
50*50umMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedCertification
CEProcessing Thickness
≤3mmProcessing Material
Semiconductor Wafer, Tgv SubstrateProcessing Material 2
IC Packaging Thin Glass, Mini Optical Chip GlassPower Supply
Three-Phase 380V AC, 50Hz, 60Hz 20ATransport Package
Wooden CaseSpecification
2200*1500*1750mmTrademark
CHANXANOrigin
SuzhouProduction Capacity
100sets/MonthCompany profile
Business Type: Manufacturer/FactoryAverage Response Time: ≤0.01h
About Our Factory & Business Background
Address180 Liantang Avenue, Changshu, Suzhou, Jiangsu, China
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsLaser Cutting Machine, Glass Cutting Machine, FPC Cutting Machine, PCB Cutting Machine, Precision Laser Cutting, Cutting Machine, Femtosecond Laser Cutting Machine, Picosecond Laser Cutting Machine, Nanosecond Laser Cutting Machine, Pi Film Laser Cutting
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:
Chanxan (Changshu) Laser Technology Co., Ltd.
Chanxan (Changshu) Laser Technology Co., Ltd.*Content:
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