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Industrial Precision Fiber Laser Cutting Machine for Advanced Ceramic Substrate
US$4,889.00
1 Set

Product specifications

Purchase Options

Product profile

Customization

Available

After-sales Service

Overseas Technical Support

Warranty

12 Months

Model NO.

CW-6060

Application

Aerospace Industry, Automotive Industry, Semiconductor Ceramic Substrate Packaging

Cooling System

Water Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Ceramic Substrate Material

Structure Type

Gantry Type

Laser Classification

Fiber Laser

Laser Technology

Laser Cold Ablation Cutting

Laser Type

Fiber Laser

Laser Power

150W-1000W

Working Area

600*600/1000*800mm

Positioning Accuracy

1um

Processing Speed

5000-25000mm/S

Machinery Test Report

Provided

Video Outgoing-Inspection

Provided

Certification

CE

Processing Material 4

Aluminum Nitride

Processing Material 5

Zirconia Ceramic

Processing Material 6

Aluminum Oxide

Power Supply

AC 380V+10%, 50Hz/60Hz

Transport Package

Plywood Wooden Case

Specification

1800*1430*1850mm

Trademark

CHANXAN

Origin

Suzhou

Production Capacity

100sets/Month

Key features

Exclusive Ceramic Substrate Processing: Perfect cold ablation cutting for alumina ceramic, AlN ceramic and zirconia ceramic substrates, no thermal damage, chipping or cracking, ultra-high finished yie
High-Speed Cold Laser Machining: Max processing speed up to 25,000 mm/s, greatly boost semiconductor ceramic substrate output and lower overall manufacturing cost.
Advanced CCD Visual Automation: Equipped with high-resolution CCD vision, auto-focusing and auto-centering system, ensure stable micron-level precision during mass ceramic substrate batch production.
Customized Ceramic Processing Solution: Support personalized customization of working area, laser power and cutting fixtures for different thickness & shape electronic ceramic substrates.
Reliable Core Component Warranty: 12-month full warranty on all fiber laser core parts, free repair and replacement of non-consumable accessories for failures not caused by human error.
24/7 Global Overseas Technical Support: Professional after-sales team provides remote video debugging, online operation training and lifelong maintenance service for ceramic cutting equipment.
Authorized Standard Certification: Passed CE certification and complies with ISO9001:2015 quality management system, stable long-term running performance for microelectronics factories.

Company profile

Chanxan (Changshu) Laser Technology Co., Ltd.
Cooperated with Fortune 500Experienced TeamManagement CertificationStandardized quality control
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Full Customization, etc. CertifiedNearest Port: Shanghai PortAverage Response Time: ≤0.01h CertifiedTerms of Payment: LC, T/T, D/P, etc.

About Our Factory & Business Background

Address180 Liantang Avenue, Changshu, Suzhou, Jiangsu, China
Plant Area44854.15 square meters
Registered Capital70,000,000 RMB
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsLaser Cutting Machine, Glass Cutting Machine, FPC Cutting Machine, PCB Cutting Machine, Precision Laser Cutting, Cutting Machine, Femtosecond Laser Cutting Machine, Picosecond Laser Cutting Machine, Nanosecond Laser Cutting Machine, Pi Film Laser Cutting
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
Traceability of Raw MaterialsYes

Our Industry Experience & Global Business Record

Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff48
Overseas Agent/BranchNo

Our Certifications, Standards & Industry Recognition

Product CertificationCE
Cooperated with Fortune 500Yes

Product Q&A

Q:What we can do for you?
A:
We customize micron cold ablation cutting solutions for alumina, AlN and zirconia ceramic substrates. Our fiber laser cutting machine solves cracking, chipping and thermal damage problems during semiconductor ceramic processing, helping microelectronics factories raise finished yield and cut manufacturing costs.
Q:Are you a trade company or manufacturer?
A:
We are a professional manufacturer with independent R&D workshop, focusing on fiber laser precision cutting equipment for semiconductor ceramic substrates like alumina and AlN packaging substrates.
Q:What is your delivery date?
A:
Around 35 working days after receiving deposit for our ceramic substrate fiber laser cutting machine.
Q:Can we become your global agent?
A:
We sincerely welcome agents engaged in semiconductor, microelectronics and electronic ceramic substrate industry. We supply full professional training for ceramic laser cutting equipment, complete after-sales backup, exclusive agent discount and stable commission profit.
Q:What after-sales support can you offer?
A:
We provide 12-month full warranty on all core fiber laser components of ceramic cutting equipment. Within warranty, free repair and free replacement of non-consumable parts are available for non-artificial failures. We offer 24/7 overseas remote video debugging, operation training and lifelong maintenance service for semiconductor ceramic substrate processing machines.

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