Exclusive Ceramic Substrate Processing: Perfect cold ablation cutting for alumina ceramic, AlN ceramic and zirconia ceramic substrates, no thermal damage, chipping or cracking, ultra-high finished yie
High-Speed Cold Laser Machining: Max processing speed up to 25,000 mm/s, greatly boost semiconductor ceramic substrate output and lower overall manufacturing cost.
Advanced CCD Visual Automation: Equipped with high-resolution CCD vision, auto-focusing and auto-centering system, ensure stable micron-level precision during mass ceramic substrate batch production.
Customized Ceramic Processing Solution: Support personalized customization of working area, laser power and cutting fixtures for different thickness & shape electronic ceramic substrates.
Reliable Core Component Warranty: 12-month full warranty on all fiber laser core parts, free repair and replacement of non-consumable accessories for failures not caused by human error.
24/7 Global Overseas Technical Support: Professional after-sales team provides remote video debugging, online operation training and lifelong maintenance service for ceramic cutting equipment.
Authorized Standard Certification: Passed CE certification and complies with ISO9001:2015 quality management system, stable long-term running performance for microelectronics factories.