Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB

Name: Multilayer Immersion Gold Electronics Mobile Phone Circuit Board PCB
Brand: Shenzhen STHL Technology Co., Ltd.
SKU: 890728145

Guangdong, ChinaShenzhen STHL Technology Co., Ltd.

US$0.10-1.00

1 PCS

Sample price:US$1.00/pcs.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

FR-4

Model NO.

pcb1109

Material

Fiberglass Epoxy

Application

Communication

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Metal Composite Materials

Brand

OEM/ODM PCB

MOQ

1 PCS

Certificate

ISO9001 2015, TUV Sud

Min Hole Size

0.1mm (4 Mil)

Copper Thickness

0.5 Oz-3oz (18 Um-385 Um)

Board Thickness

0.2mm-4mm

Surface Finish

HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc

Service

PCB/PCBA/PCB Design and Layout

Test Service

E-Test, Aoi, X-ray, Function Test

Specialised

Medical, Industrial, Control Board,Ce

Delivery

PCB Board, 3-5 Days;PCBA, 2-3weeks

Product Name

Electronics Mobile Phone Circuit Board PCB

Transport Package

Vacuum Packing/Blister/Plastic /Cartoon

Specification

CE, RohS, UL, SGS, ISO9001, 94v0

Trademark

Mobile Phone Circuit Board PCB

Origin

Shenzhen, Guangdong

HS Code

8534009000

Production Capacity

500000000PCS/Year

Company profile

High Repeat Buyers ChoiceFast DeliveryODM ServicesManagement Certification

Shenzhen STHL Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs CertifiedExport Year: 8 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h

AI-Powered supplier vetting

SummaryThe supplier is identified as a professional technical supplier and a combined company, with manufacturing, export, service, quality-control, and R&D capabilities. It reports 100 employees, 2,000 square meters of premises, four R&D engineers, six SMT lines, two DIP lines, one final assembly line, and advanced testing instruments. It supports customization from samples and designs and provides ODM services, but has no new products reported in the past year, no 3D software design, and no SDK. Quality procedures include finished-product inspection instructions, corrective and preventive actions, complaint handling, quality assurance, and raw-material traceability. Export activity is substantial, but there is no overseas warehouse, showroom, agent, branch, or offline trade-show participation. Financial credibility, certifications, and specific customer cases are not sufficiently evidenced.

Supplier typeThe supplier is explicitly described as a professional technical supplier and a combined company. Its profile covers manufacturing, export, service, quality control, and R&D, supported by stated production facilities and engineering personnel.

After-Sales capabilityThe supplier has clear procedures and followed records for handling customer complaints, along with a corrective and preventive action mechanism. This directly supports an organized after-sales response capability.

R&D capabilityThe supplier has four R&D engineers, provides ODM services, and describes a focus on development and innovation. However, it reported no new products in the past year, no 3D software design service, and no available SDK, so innovation capability is evidenced but limited in the stated areas.

Production capacityThe supplier reports six SMT production lines, two DIP lines, one final assembly line, advanced testing instruments, and lead times within 15 working days in both peak and off-season. However, it has no in-stock capacity and no valid contract with related subcontractors, indicating some production-continuity limitations.

Customization capabilityThe supplier explicitly offers customization from samples and designs and provides ODM services. This demonstrates both sample-based and design-based customization capability, although no 3D software design service or SDK is available.