Professional PCBA Circuit Assembly Manufacturer Non Contact Infrared Thermometer PCB Board

Name: Professional PCBA Circuit Assembly Manufacturer Non Contact Infrared Thermometer PCB Board
Brand: Shenzhen STHL Technology Co., Ltd.
SKU: 905593375

Guangdong, ChinaShenzhen STHL Technology Co., Ltd.

US$50.00

1-499 pcs

US$30.00

500-1,999 pcs

US$25.00

2,000-4,999 pcs

US$20.00

5,000-9,999 pcs

US$10.00

10,000+ pcs

Sample price:US$50.00/pcs.Request sample

Product profile

Customization

Available

Metal Coating

Copper

Mode of Production

SMT

Model NO.

Non contact infrared thermometer PCB board

Layers

Double-Layer

Base Material

FR-4

Certification

RoHS, ISO, TUV:Sud

Customized

Condition

New

Layer

1-24

Surface Finishing

HASL, Enig, OSP, Immersion Au, AG, Sn

Min.Hole Size

0.1mm (4 Mil)

Min.Line Spacing

0.075mm (3mil)

Board Thickness

0.2mm-4mm

PCBA QC

X-ray, Aoi Test, Function Test(100% Test)

Specialised

LED, Medical, Industrial, Control Board

Delivery

PCB, 7-10 Days;PCBA, 2-3weeks

Application

SMT PCB Assembly

Products Name

Non Contact Infrared Thermometer PCB Board

Transport Package

Vacuum Packing/Blister/Plastic /Cartoon

Specification

CE, RohS, UL, SGS, ISO9001: 2015, 94v0

Trademark

Factory Price Fr-4 Circuit Board Custom PCB Assemb

Origin

Shenzhen, Guangdong

HS Code

8534009000

Production Capacity

8000, 000PCS /Month

Company profile

High Repeat Buyers ChoiceFast DeliveryODM ServicesManagement Certification

Shenzhen STHL Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs CertifiedExport Year: 8 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤11.77h

AI-Powered supplier vetting

SummaryThe supplier is identified as a professional technical supplier and a combined company, with manufacturing, export, service, quality-control, and R&D capabilities. It reports 100 employees, 2,000 square meters of premises, four R&D engineers, six SMT lines, two DIP lines, one final assembly line, and advanced testing instruments. It supports customization from samples and designs and provides ODM services, but has no new products reported in the past year, no 3D software design, and no SDK. Quality procedures include finished-product inspection instructions, corrective and preventive actions, complaint handling, quality assurance, and raw-material traceability. Export activity is substantial, but there is no overseas warehouse, showroom, agent, branch, or offline trade-show participation. Financial credibility, certifications, and specific customer cases are not sufficiently evidenced.

Supplier typeThe supplier is explicitly described as a professional technical supplier and a combined company. Its profile covers manufacturing, export, service, quality control, and R&D, supported by stated production facilities and engineering personnel.

After-Sales capabilityThe supplier has clear procedures and followed records for handling customer complaints, along with a corrective and preventive action mechanism. This directly supports an organized after-sales response capability.

R&D capabilityThe supplier has four R&D engineers, provides ODM services, and describes a focus on development and innovation. However, it reported no new products in the past year, no 3D software design service, and no available SDK, so innovation capability is evidenced but limited in the stated areas.

Production capacityThe supplier reports six SMT production lines, two DIP lines, one final assembly line, advanced testing instruments, and lead times within 15 working days in both peak and off-season. However, it has no in-stock capacity and no valid contract with related subcontractors, indicating some production-continuity limitations.

Customization capabilityThe supplier explicitly offers customization from samples and designs and provides ODM services. This demonstrates both sample-based and design-based customization capability, although no 3D software design service or SDK is available.