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Electroformed Diamond Micro Blade Dicing Blade for Grooving and Cutting off Various Metalloid Materials
US$32.00
10-49 Pieces
US$30.00
50-99 Pieces
US$25.00
100+ Pieces
Product profile
Material
DiamondAbrasive
Normal AbrasiveShapes
RoundTypes
CuttingGrain Size
OtherCylindricity
<0.5Circular Degree
<0.1Technics
SinterWorking Style
Tool GrindingWidth
CustomizedThickness
0.1-1mmProduct Name
Resin Bond Diamond Dicing BladeShape
Round Flat WheelBonding Agent
Electroplated Bond/Resin Bond/Metal BondUsage
Semiconductor Material CuttingApplication
Cutting Scribing Glass,Quartz, Lita03 Linb03Advantage
High Efficient,High AccuracyMOQ
1PCSTransport Package
CartonsSpecification
50-120mm, customizedTrademark
RZOrigin
ChinaProduction Capacity
100000pieces/YearKey features
Customizable Dimensions: Width is fully customized; Thickness ranges from 0.1-1mm.
High Precision Cutting: Circular degree <0.1 and cylindricity <0.5 for accurate dicing.
Versatile Bond Options: Available in Electroplated, Resin, and Metal bonds for various materials.
Broad Material Application: Ideal for Silicon, GaAs, SiC, Glass, Quartz, and Semiconductor wafers.
Low Minimum Order: MOQ is only 1 PCS, suitable for testing and small batch production.
Fast Delivery Options: Off-season delivery within 15 workdays; Peak season within one month.
Full Customization Service: Supports OEM/ODM with full customization from customer designs.
High Efficiency & Accuracy: Designed for high-efficient, high-accuracy cutting in precision manufacturing.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Designs, Full Customization CertifiedExport Year: 9 Years CertifiedNearest Port: Tianjin PortAverage Response Time: ≤1.99h
About Our Factory & Business Background
AddressRoom 902, Building3, Longcheng Square, Wenhua North Road, Huiji District, Zhengzhou, Henan, China
Plant Area270 square meters
Number of Employees19
Registered Capital500,000 RMB
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 Pcs
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsHardware Products, Ordinary Mechanical Equipment
R&D Engineers3 people
Our Industry Experience & Global Business Record
Year of Establishment2014-08-19
Main MarketsNorth America, Europe, Southeast Asia/ Mideast
Repeat Buyers Choice50%~80%
Annual Export Revenue634,662.7 USD
Number of Foreign Trading Staff11
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What materials can this diamond dicing blade cut?
A:
It is suitable for cutting various metalloid materials including silicon wafers, copper wafers, compound semiconductors (GaAs, SiC), glass, quartz, lithium niobate, and ceramic packaging materials.
Q:What customization options are available?
A:
We offer full customization including width (customized), thickness (0.1-1mm), and bonding agents (Electroplated, Resin, or Metal). OEM and ODM services are also available based on your designs.
Q:What is the minimum order quantity (MOQ)?
A:
The MOQ is 1 PCS, allowing for easy testing and small batch orders.
Q:What are the delivery times?
A:
Delivery takes 3-30 days after order confirmation. Specifically, off-season lead time is within 15 workdays, while peak season lead time is one month.
Q:What are the precision specifications of the blade?
A:
The blade features high precision with a cylindricity of <0.5 and a circular degree of <0.1, ensuring accurate cutting performance.
Send Inquiry
*To:
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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