High Quality Wet Grinding Dicing Blade Wafer Dicing Blades Ceramic Substrate Scribing Dicing Blades

Name: High Quality Wet Grinding Dicing Blade Wafer Dicing Blades Ceramic Substrate Scribing Dicing Blades
Brand: Zhengzhou Ruizuan Diamond Tool Co., Ltd.
SKU: 1960012161

Henan, ChinaZhengzhou Ruizuan Diamond Tool Co., Ltd.

US$32.00

10-49 Pieces

US$28.00

50-99 Pieces

US$25.00

100+ Pieces

Product profile

Customization

Available

Material

Diamond

Abrasive

Superabrasive

Shapes

Round

Types

Straight Grinding Wheels

Grain Size

1500-5000grit

Cylindricity

<0.5

Circular Degree

<0.1

Technics

Sinter

Working Style

Tool Grinding

Product Name

Electroplated Diamond Dicing Blade with Hub

Shape

Flat-Shaped

Application

Scribing Dicing IC Wafers, Gallium Arsenide

Applicable Machine

Scribing Machine

Usage

Wafer Dicing

Packing

Carton

Transport Package

Cartons

Specification

customized

Trademark

Origin

China

Production Capacity

100000pieces/Year

Key features

Customizable Size: Size can be customized according to specific requirements.

Versatile Material Application: Suitable for silicon wafers, compound semiconductors, glass, and ceramics.

High Efficiency and Long Life: Delivers high-efficiency performance with a long service life.

Fast Delivery Time: Delivery within 35-35 days depending on order quantity and season.

OEM and ODM Services: OEM and ODM services are available for client needs.

Low Minimum Order Quantity: Minimum order quantity is as low as 1 piece.

Company profile

High Repeat Buyers ChoiceFast DeliveryCustomization from DesignsR&D Capabilities

Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Henan, China

Business Type: Trading CompanyAverage Response Time: ≤2.02h

AI-Powered supplier vetting

SummaryZhengzhou Ruizuan Diamond Tool Co., Ltd. is identified as a limited trading company in Zhengzhou with 19 employees and valid import/export licensing. It offers full customization, ODM, and OEM services, has substantial export exposure, and reports nine years of export experience. Operational strengths include in-stock service capacity, overseas warehouse capability, multiple quotation and payment options, and documented complaint-handling procedures. However, several controls remain undocumented or incomplete, including corrective and preventive action procedures, raw-material traceability, outsourcing manufacturing procedures and contracts, and fire-drill status. The supplier has no overseas showroom, no SDK availability, and no explicit production-facility evidence. An SGS audit is recorded, but the stated audit result is 0 and the report validity ended in 2024; the provided data does not explain the scoring system or confirm current certification status.

Supplier typeThe supplier is described as a limited company and a trading company located in Zhengzhou, with 19 employees and valid import/export licensing. Its primary offerings are hardware products and ordinary mechanical equipment, while no larger-company affiliation is indicated.

After-Sales capabilityThe supplier has a clear customer-complaint procedure with follow-up records and describes a commitment to customer service. It also reports in-stock capability, overseas warehouse capability, multiple quotation and payment terms, and defined peak- and off-season lead times; however, corrective and preventive-action procedures are not documented.

R&D capabilityThe supplier provides ODM services and full customization or customization from designs, indicating design-related capability. It does not provide an SDK, and the available information does not establish broader research investment, proprietary technology, or measurable innovation outcomes.

Customization capabilityThe supplier explicitly offers full customization and customization from designs, as well as ODM services. These statements directly support a capability to provide customized products and design-based manufacturing services.

Client casesThe supplier states that it provides OEM services for well-known brands and reports that exports represent 71%–90% of total sales, with nine years of export experience. These are indications of relevant customer and international-market experience, but no customer names, project details, or independently verifiable case studies are provided.

Product Q&A

Q:What materials can this blade cut?

It is used for grooving and cutting silicon wafer, compound semiconductors, glass, IC wafers, gallium arsenide, ceramic substrates, and epoxy resin boards.

Q:Is the size customizable?

Yes, the size can be customized according to your specific requirements.

Q:What is the delivery time?

Delivery takes 25-35 days after confirming the order, depending on the production season and order quantity.

Q:Do you offer OEM or ODM services?

Yes, both OEM and ODM services are available, including full customization and customization from designs.