High Efficiency Binding: Semi-automatic hot melt glue binding machine designed for high efficiency book binding operations.
Digital Temperature Control: Features intelligent digital temperature control for precise and stable glue melting performance.
Safety & Stability: Safe and stable low voltage intelligent PC version design with automatic fault detection function.
Wide Thickness Range: Supports maximum binding thickness of 50mm and cover paper thickness from 50-400g.
Fast Warm-up Time: Quick warm-up time of only 10 minutes, ensuring efficient daily operation and convenience.
OEM/ODM Customization: Supports full customization, minor customization, and flexible customization from samples or designs.
Compact Design: Machine dimensions are 650*350*500mm with a net weight of 30kg, suitable for various spaces.
100% Quality Inspection: Every finished product undergoes 100% visual and functional inspection before shipment.