Solvent-Free Formula: Environmentally friendly and safe for indoor use with zero VOC emissions.
Fast Curing Speed: Cures quickly to shorten setting time, with pot life of 40-60 minutes.
High Expansion Ratio: Foam percentage 30-100%, effectively filling cracks between substrates.
Excellent Adhesion: Widely applied to heat-insulation plates, ceilings, and clean room partitions.
Customizable Packaging: Packaging can be adjusted according to customer's specific requirements.
OEM/ODM Support: Full customization, minor customization, and flexible customization available.
Heat & Humidity Resistant: Maintains performance in various temperatures and high humidity environments.