Ultra-Thin FPC Design: Board thickness ranges from 0.11mm to 0.5mm for compact smartphone camera modules.
Custom Made Dimensions: Board size is fully customizable to meet specific design requirements.
High Precision Manufacturing: Features min hole size of 0.075mm, min line width of 0.05mm, and spacing of 0.05mm.
Multi-Layer Capability: Supports 1 to 6 layers with PI base material and OSP surface finishing.
OEM/ODM Services: Full customization options available from samples, designs, or flexible requirements.
ISO and UL Certified: Products comply with EU RoHS standards and carry UL certification for safety.
Rapid Prototyping: Specializes in quick turnaround for small-batch production and design validation.
Flexible Assembly: Provides assembly services with gold finger FPC options for consumer electronics.