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Ceramic Silicon Wafer Metal High Precision Single Side Lapping and Polishing Machine
US$10,000.00-20,000.00
1 Piece
Product profile
Customization
AvailableWarranty
1 YearType
Surface Grinding MachineModel NO.
kd24bxProcessing Object
Metal&NonmetalAutomatic Grade
SemiautomaticPrecision
High PrecisionCertification
CE, ISO 9001Condition
NewMax. Grinding Diameter
215mmModel Number
Kd24bVoltage
380VPower
2.3kwWeight
790kgAfter-Sales Service Provided
Engineers Available to Service Machinery OverseasTransport Package
Standard Export PackingSpecification
1260*1570*1480mmTrademark
KiziOrigin
ChinaCompany profile

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2016-07-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤5.55h CertifiedTerms of Payment: T/T
AI-Powered supplier vetting
SummaryDongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd., established in 2010, specializes in high precision grinding and polishing machinery. With a manufacturing area of 6809m² and 47 employees, the company serves various markets including Europe and Asia. Known for its commitment to quality and customer satisfaction, it has a strong foreign trade presence with a 67% repurchase rate. The company's products are recognized for stability and precision, particularly in the CNC blade and optical glass industries.
Supplier typeThe supplier is a combined entity, specifically a limited company located in China.
Financial creditThe supplier has registered capital of 5,000,000 RMB, indicating a solid financial foundation.
R&D capabilityThe company focuses on R&D and has developed high precision CNC equipment, showcasing its innovation capability.
Production capacityWith six production lines and an annual output of US$10-50 million, the supplier demonstrates strong production capability.
Client casesThe supplier's equipment is used by glass wafer and optical glass companies in Germany and Russia, indicating successful customer cases.
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