Powered by Made-in-China.com
Exportable High Precision Silicon Wafers Thinning and Lapping Machine for Gallium Nitride
US$20,000.00-40,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
KJ200W-1Type
Honing MachineProcessing Object
Metal & Non-MetalAbrasives
Grinding PlateControlling Mode
NormalAutomatic Grade
SemiautomaticPrecision
High PrecisionCertification
ISO 9001Condition
NewMachine Weight
1100kgMax. Lapping Diameter
200mmAfter-Sales Service Provided
Engineers Available to Service Machinery OverseasOptimal Flatness
0.001mmOptimal Roughness
0.001mmTransport Package
Standard Export PackingSpecification
1200*1350*2250Trademark
KIZIOrigin
Dongguan, ChinaProduction Capacity
5 Sets/MonthCompany profile

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2016-07-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.53h CertifiedTerms of Payment: T/T
AI-Powered supplier vetting
SummaryDongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd., established in 2010, specializes in high precision grinding and polishing machinery. With a manufacturing area of 6809m² and 47 employees, the company serves various markets including Europe and Asia. Known for its commitment to quality and customer satisfaction, it has a strong foreign trade presence with a 67% repurchase rate. The company's products are recognized for stability and precision, particularly in the CNC blade and optical glass industries.
Supplier typeThe supplier is a combined entity, specifically a limited company located in China.
Financial creditThe supplier has registered capital of 5,000,000 RMB, indicating a solid financial foundation.
R&D capabilityThe company focuses on R&D and has developed high precision CNC equipment, showcasing its innovation capability.
Production capacityWith six production lines and an annual output of US$10-50 million, the supplier demonstrates strong production capability.
Client casesThe supplier's equipment is used by glass wafer and optical glass companies in Germany and Russia, indicating successful customer cases.
Send Inquiry
*To:
Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.
Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
for Grinding Diamond Semiconductor Materials Automatic Wafer Grinding and Thinning Machine
US$30,000.00-50,000.00
1 Piece(MOQ)
Semi-Automatic Vertical High Precision Thinning and Lapping Machine for Optical Windows
US$30,000.00-50,000.00
1 Piece(MOQ)
Silicon Wafer Double Side Grinding Machine for IC Manufacturing
US$6,500.00-7,000.00
1 Piece(MOQ)
Automatic High Precision Thinning and Lapping Machine for Zirconia Ceramics
US$155,840.00-183,774.00
1 Piece(MOQ)
High Precision and Speed Thinning and Lapping Machine for Gallium Nitride
US$30,000.00-50,000.00
1 Piece(MOQ)
Popular Precision Single-Lapping Machine for Diamond Wafers
US$133,800.00
1 Set(MOQ)
IC Silicon Wafer Thinning Machine High Precision
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Double Side Grinding Machine for IC Wafer
US$6,500.00-7,000.00
1 Piece(MOQ)
High Precision Rotary Table Surface Grinding Flat Lapping Machine for Metal Ceramic
US$4,800.00
1 Piece(MOQ)
Precision Double Sided Surface Grinding Polishing and Lapping Machine for Ceramics
US$41,000.00-65,000.00
1 Piece(MOQ)
Stationary Grinding and Lapping Machine for The Machining of Sealing Surfaces with High Speed From China Manufacturer
US$8,900.00-12,500.00
1 Piece(MOQ)
High Precision Thinning and Lapping Machine for Silicon Wafers
US$39,999.00-59,999.00
1 Piece(MOQ)
High Precision Portable Lapping and Grinding Machine for Globe Valve Sealing with Good Price
US$12,000.00-14,000.00
1 Piece(MOQ)
High-Speed Flat Lapping Machine for Metal Surface Thinning & Precision Grinding
US$60,000.00
1 Piece(MOQ)
Silicon Wafer Thinning Machine for Microelectronics
US$6,500.00-7,000.00
1 Piece(MOQ)
Series B Precision Surface Polishing and Lapping Machine for Sapphire Single Side Processing
US$8,000.00-12,000.00
1 Piece(MOQ)
High-Precision Grinding Machines for Enhanced Performance and Durability
US$150,000.00
1 Piece(MOQ)
Silicon Wafer High Precision Grinding and Polishing Machine
US$80,000.00-100,000.00
1 Piece(MOQ)











