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Diamond Dicing Blades Without Hub, 1A8, for Wafer, Semiconductor Industry
US$10.00-50.00
1 Piece
Sample price:US$0.00/piece.Request sample
Product profile
Customization
AvailableBlade Type
DicingManufacturing Process
SinteredModel NO.
1A8Application
Cutting, Grooving, Dicing of WafersFeature
Fast Cutting, Long Diamond Life, No ChippingBond
Special Bond DesignCutting Condition
WetThickness
0.002"-0.008"Diameter
10mm-80mmCore/Body
No CoreAdvantage
Highly DurableManufacturer
E-GrindPacking
BoxTransport Package
Express, Air, Paper Box with Plastic FoamSpecification
Diamond, Metal, Resin, filltersTrademark
E-GrindOrigin
ChinaHS Code
68042210Production Capacity
30000PCS/YearCompany profile
Business Type: Manufacturer/FactoryExport Year: 2009-06-12Average Response Time: ≤2.93h
About Our Factory & Business Background
Address1841&1842, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou, Henan, China
Our Production Capability & Technical Expertise
Main ProductsDiamond/CBN Grinding Wheels, PDC PCD, Synthetic Diamond Powder, CBN, Sharpening Stone, Conventional Abrasives and Tools
Send Inquiry
*To:
Henan E-Grind Abrasives Co., Ltd.
Henan E-Grind Abrasives Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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